Curing behavior and thermal properties of trifunctional epoxy resin cured by 4, 4’-diaminodiphenyl sulfone

Cheng, Jiang; Li, J.; Zhang, J. Y.

doi:10.3144/expresspolymlett.2009.62

Cited by 47 publications

(27 citation statements)

References 24 publications

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“…This temperature reflects the structural behavior of the resin when the cure reaction is complete 16 , therefore, the proximity between the value obtained by DSC analysis and the value presented in the data sheet is also an indicative of an adequate curing cycle.…”

Section: Dscmentioning

confidence: 99%

Development of a Simple Dielectric Analysis Module for Online Cure Monitoring of a Commercial Epoxy Resin Formulation

Raponi

Barban

et al. 2017

Mat. Res.

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The final properties of thermosets are strongly dependent on their curing process. Therefore, closely monitoring this process is necessary to assure the manufacturing quality and productivity. In this way, the aim of this study is to develop a simple dielectric module for monitoring and optimizing the industrial curing cycle of thermosets. The module is based on a data acquisition system and an interdigital sensor that remains in contact with the resin throughout the entire curing process. Dielectric analysis (DEA) was performed in a commercial epoxy resin formulation widely used as a matrix for thermoset composites, which was submitted to a pre-established and validated curing cycle. The properties derived from DEA measurements are in accordance with differential scanning calorimetry (DSC) results, allowing the identification of key stages of the curing process. The similarity between the results of both techniques is a strong indicative of the possibility of using the developed module as an alternative for industrial cure monitoring and optimization.

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Section: Dscmentioning

confidence: 99%

Development of a Simple Dielectric Analysis Module for Online Cure Monitoring of a Commercial Epoxy Resin Formulation

Raponi

Barban

et al. 2017

Mat. Res.

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“…Using the simplified formula of strain energy resulted in only 0.06 % error in the Eeff values calculated from our experimental data. In this simplified case, the effective moduli of the pipe material can be calculated from ring compression test results using formula (14). is the moment of inertia of the pipe wall calculated with respect to the axis of bending, where l is the width of the ring specimen, t is the wall thickness of the specimen.…”

Section: Calculation For Regular Egg-shaped Profilesmentioning

confidence: 99%

“…Researchers are developing better sizing methods which require more accurate material properties. Because of the uncommon material behavior, hundreds of possible fiber-matrix combinations and sensitive curing process [14], testing is even more important in case of composite materials than in case of metals. The most effective tests should be executed on the composite parts themselves, because the reinforcing fiber structure can be kept unaffected in this way.…”

Section: Introductionmentioning

confidence: 99%

Determination of hoop direction effective elastic moduli of non-circular profile, fiber reinforced polymer composite sewer liner pipes from lateral ring compression tests

Czél

Takács

2015

International Journal of Pressure Vessels and Piping

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A new material property determination method is presented for the calculation of effective elastic moduli of non-circular ring specimens cut from filament wound oval profile polymer composite sewer liner pipes. The hoop direction elastic moduli was determined using the test results obtained from ring compression tests, which is a very basic setup, and requires no special equipment. Calculations were executed for many different oval profiles, and diagrams were constructed, from which the cross section dependent Ceff constants can be taken. The new method was validated by the comparison of tests and finite element analysis 2 results. The calculation method and the diagrams are essential design tools for engineers, and a big step forward in sizing non-circular profile liner pipes .

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“…Epoxy resins with different modifiers are available to improve material properties, for example rubber additives for flexibility (Boyle et al, 2001). One disadvantage is the decomposition and deformation of polymers (Beyler and Hirschler, 2001;Cheng et al, 2009). Some electrically insulating high-temperature epoxy 1.8 mm composites already exist that allow operating temperatures up to about 260 • C, for example the Duralco 4461 (Polytec PT GmbH, 2010) has a maximal operating temperature of 260 • C but the deformation temperature is about 210 • C hence it is not suitable for the envisaged application.…”

Section: Choice Of Materialsmentioning

confidence: 99%

Encapsulation of implantable integrated MEMS pressure sensors using polyimide epoxy composite and atomic layer deposition

Gembaczka¹,

Görtz²,

Celik³

et al. 2014

J. Sens. Sens. Syst.

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Abstract. Implantable MEMS sensors are an enabling technology for diagnostic analysis and therapy in medicine. The encapsulation of such miniaturized implants remains a largely unsolved problem. Medically approved encapsulation materials include titanium or ceramics; however, these result in bulky and thick-walled encapsulations which are not suitable for MEMS sensors. In particular, for MEMS pressure sensors the chip surface comprising the pressure membranes must be free of rigid encapsulation material and in direct contact with tissue or body fluids. This work describes a new kind of encapsulation approach for a capacitive pressure sensor module consisting of two integrated circuits. The micromechanical membrane of the pressure sensor may be covered only by very thin layers, to ensure high pressure sensitivity. A suitable passivation method for the high topography of the pressure sensor is atomic layer deposition (ALD) of aluminium oxide (Al 2 O 3 ) and tantalum pentoxide (Ta 2 O 5 ). It provides a hermetic passivation with a high conformity. Prior to ALD coating, a high-temperature resistant polyimide-epoxy composite was evaluated as a die attach material and sealing compound for bond wires and the chip surface. This can sustain the ALD deposition temperature of 275 • C for several hours without any measurable decomposition. Tests indicated that the ALD can be deposited on top of the polyimide-epoxy composite covering the entire sensor module. The encapsulated pressure sensor module was calibrated and tested in an environmental chamber at accelerated aging conditions. An accelerated life test at 60 • C indicated a maximum drift of 5 % full scale after 1482 h. From accelerated life time testing at 120 • C a maximum stable life time of 3.3 years could be extrapolated.

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Curing behavior and thermal properties of trifunctional epoxy resin cured by 4, 4’-diaminodiphenyl sulfone

Cited by 47 publications

References 24 publications

Development of a Simple Dielectric Analysis Module for Online Cure Monitoring of a Commercial Epoxy Resin Formulation

Development of a Simple Dielectric Analysis Module for Online Cure Monitoring of a Commercial Epoxy Resin Formulation

Determination of hoop direction effective elastic moduli of non-circular profile, fiber reinforced polymer composite sewer liner pipes from lateral ring compression tests

Encapsulation of implantable integrated MEMS pressure sensors using polyimide epoxy composite and atomic layer deposition

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