Cu wiring into nano-scale holes by electrodeposition in supercritical carbon dioxide emulsified electrolyte with a continuous-flow reaction system

Shimizu, Tetsuya; Ishimoto, Yuma; Chang, Tso-Fu Mark; Kinashi, Hikaru; Nagoshi, Takashi; Sato, Tatsuo; Sone, Masato

doi:10.1016/j.supflu.2014.03.010

Cited by 13 publications

(10 citation statements)

References 16 publications

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“…These plating mechanisms are called periodic plating characteristics (PPC) [28,29]. The efficient hole filling was observed in the Cu filling to the hole with 70 nm in diameter and 350 nm in depth as shown in Figure 3 [30,31]. PPC also contributes to the film strengthening via grain refinement.…”

Section: Fabrications Of Memsmentioning

confidence: 99%

Evaluation Methods of Mechanical Properties of Micro-Sized Specimens

Nagoshi¹,

Chang²

2019

Novel Metal Electrodeposition and the Recent Application

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Micro-sized components have been widely used to microelectromechanical systems (MEMSs) and medical apparatus in recent years. Measurement methodologies of the mechanical property of small materials need to be improved for structural designing of these devices because of their component size reduced to micro-or nano-regime where sample size effects emerge. Mechanical properties and deformation behavior could be very different with their dimensions and geometries especially for small materials. Our experiments on the micro-specimen tested in different dimensions and loading directions are suitable for the evaluations of materials for MEMS components. In this chapter, recent studies on micro-testing of bending, compression, and tension with micro-sized samples will be presented including fabrication methods of non-tapered micro-sized specimens.

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Section: Fabrications Of Memsmentioning

confidence: 99%

Evaluation Methods of Mechanical Properties of Micro-Sized Specimens

Nagoshi¹,

Chang²

2019

Novel Metal Electrodeposition and the Recent Application

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“…In reaction areas where the micelle is in contact, deposition must be stopped and eventually resume with bulk concentration of electrolyte. These features, which are called periodic plating characteristics (PPC) [8,9], will contribute to the gap or hole filling in EP-SCE and attained Cu filling of a hole 70 nm in diameter and 350 nm in depth as shown in Figure 2 [10,11]. Results of the metal deposition using EP-SCE are summarized in Table 1.…”

Section: Microstructure Of Electrodeposited Metalmentioning

confidence: 99%

Mechanical Property Evaluation of Electrodeposited Nanocrystalline Metals by Micro-testing

Nagoshi¹,

Chang²,

Sone³

2015

Electroplating of Nanostructures

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Electrodeposition is a very important technology in the fabrication of micro-components for micro-electro-mechanical systems MEMS or integrated circuits. Evaluations of the materials used in these devices as D components should be conducted using micro-sized specimens due to the sample size effect on the practical use of the components. Nanocrystalline metals could be deposited using an electrodeposition method with supercritical CO emulsion. Our experiment on the micro-specimens provides information on micro-mechanical testing of electrodeposited metals including the effect of sample size, grain size, and anisotropic structures on mechanical properties. In this chapter, recent studies on crystal growth in electrodeposition of metals and its evaluation using micron-sized testing will be presented.

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“…The impurity could be carbons, organics, and/or oxides. Thus, the concentration of carbon and oxygen in the electrodeposited Cu films prepared by the ED-SCS was examined by glow discharge optical emission spectroscopy (GDOES) [41]. Fig.…”

Section: Contamination In Electrodeposited Cumentioning

confidence: 99%

Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte

Sone

2015

Electroplating of Nanostructures

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Novel electrodeposition (ED) techniques utilizing supercritical carbon dioxide (scCO 2 ) emulsions (SCE) are introduced. ScCO 2 has low surface tension and high compatibility with hydrogen. Thus, this method is applied in fine Cu wiring to allow the complete filling of Cu into nanoscale confined space. The electrochemical reactions are carried out in emulsions composed of an aqueous electrolyte, scCO 2 , and surfactants. Three aspects in fine Cu wiring will be introduced, which are the dissolution of the Cu seed layer in the SCE, the gap-filling capability of the ED-SCE, and the contamination in the plated Cu. At first, the dissolution of the Cu seed layer in the SCE was observed. In order to prevent the dissolution of the Cu seed layer, the addition of Cu particles into the SCE was found to be effective. The electrolyte containing the SCE and the Cu particles is named scCO 2 suspension (SCS). The gapfilling capability was evaluated using test element groups (TEGs) with patterns of vias with a diameter of 70 nm and an aspect ratio of 5. Many defects were observed in the vias filled using the conventional electrodeposition (CONV) method. On the other hand, defect-free fillings were obtained by the ED-SCS method. Because of the highpressure environment needed to form the scCO 2 , the reaction cells are usually batchtype high-pressure vessels. In order to improve the feasibility of the ED-SCS technique, a continuous-flow reaction system is also proposed and examined using a round-type large-area TEG with a diameter of 300 mm. Complete fillings were obtained for vias with a diameter of 60 nm and an aspect ratio of 5 on the large-area TEG. This result was in good agreement with that of the batch-type reaction system and demonstrated the successful application of the continuous-flow system with ED-SCS.

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Cu wiring into nano-scale holes by electrodeposition in supercritical carbon dioxide emulsified electrolyte with a continuous-flow reaction system

Cited by 13 publications

References 16 publications

Evaluation Methods of Mechanical Properties of Micro-Sized Specimens

Evaluation Methods of Mechanical Properties of Micro-Sized Specimens

Mechanical Property Evaluation of Electrodeposited Nanocrystalline Metals by Micro-testing

Nanoscale Cu Wiring by Electrodeposition in Supercritical Carbon Dioxide Emulsified Electrolyte

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