2012
DOI: 10.1016/j.electacta.2012.04.151
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Cu-filled through-hole electrode for ZnS using high adhesive strength Ni–P thin film

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Cited by 3 publications
(3 citation statements)
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“…We assumed this reaction is substitutable and forms an interfacial layer between ZnS film and Cu substrate. 30) This interfacial layer would act the role of improving ZnS film adhesion.…”
Section: Resultsmentioning
confidence: 99%
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“…We assumed this reaction is substitutable and forms an interfacial layer between ZnS film and Cu substrate. 30) This interfacial layer would act the role of improving ZnS film adhesion.…”
Section: Resultsmentioning
confidence: 99%
“…We expected that the different additives in the deposition baths would affect the structure and composition of ZnS. 29,30) This study was performed to evaluate the structure of ZnS synthesized by electrodeposition, focusing on the effects of complexing agents in the electrodeposition process.…”
Section: Introductionmentioning
confidence: 99%
“…The accumulation of data and the knowledge of process optimization accompanying the distribution of such technologies will contribute to an expanded market for secondary urban phosphorus resources, and this will translate into a stable supply, both qualitatively and quantitatively. Among the many technologies already developed, the sulfide precipitation technique (Okamoto, Miyamoto et al 2012) and the dry-melting furnace methods, which involve significant infrastructure costs, are capable of providing a stable supply and the quantity and quality that an expanded market will require, and will be cost-effective in the long-term.…”
Section: Bottlenecks and Benefits Of P Recovery From Surface-treatmenmentioning
confidence: 99%