2007
DOI: 10.1149/1.2739209
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Cu∕CuMg Gate Electrode for the Application of Hydrogenated Amorphous Silicon Thin-Film Transistors

Abstract: The feasibility of using Cu/CuMg as a gate electrode for a-Si:H thin-film transistors ͑TFTs͒ has been investigated in this work. The issue of adhesion between the Cu film and glass substrates has been overcome by introducing the Cu/CuMg alloy. Furthermore, a wet-etching process of Cu-based gate metal has been proposed by using the copper etchant in the conventional printed circuit boards. The experimental result showed superior performance of a-Si:H TFT with desired electrode taper angle and minimal loss of cr… Show more

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Cited by 14 publications
(6 citation statements)
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“…The differences between the Cu layer and the contact layer make it complicated in the subsequent etching process [14]. In order to improve the reliability and cost of Cu gate electrodes, another method is advocated, namely, the use of Cu alloy (Cu-Mg [15,16], Cu-Ca [17][18][19], Cu-Mn [20][21][22][23], Cu-Ti [24]) instead of pure Cu to form a diffusion barrier and adhesion layer spontaneously [25].…”
Section: Introductionmentioning
confidence: 99%
“…The differences between the Cu layer and the contact layer make it complicated in the subsequent etching process [14]. In order to improve the reliability and cost of Cu gate electrodes, another method is advocated, namely, the use of Cu alloy (Cu-Mg [15,16], Cu-Ca [17][18][19], Cu-Mn [20][21][22][23], Cu-Ti [24]) instead of pure Cu to form a diffusion barrier and adhesion layer spontaneously [25].…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, the uniformity problem of EP technology limit its utility in large-size panel fabrication. [2][3][4] In this work, we propose a novel electro-less plating (ELP) method to deposit NiP serving as an adhesion layer and copper film self-aligned on it on glass substrate. ELP technology not only saves more cost than the conventional sputtering process because it can be processed in ambient air.…”
Section: Objective and Backgroundmentioning
confidence: 99%
“…Used as electrodes, tapered edges could improve the step coverage and prevent interlayer defects [7]. Applied to integrated photonic systems, tapered-metal-grating structures could exhibit high-contrast broadband asymmetric transmission covering the entire visible region [8].…”
Section: Introductionmentioning
confidence: 99%