Crystallographic texture of EB-PVD TBCs deposited on stationary flat surfaces in a multiple ingot coating chamber as a function of chamber position

Bernier, J.S; Levan, G. W.; Maniruzzaman,; Sisson, Richard D.; Bose, Sudhangshu

doi:10.1016/s0257-8972(02)00597-2

Cited by 13 publications

(4 citation statements)

References 9 publications

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“…The properties of the first principal stress in the specimen, with infinite length and cross-section dimension of 50×50 μm and the film cross-section dimension of 50 ×(1-4) μm, were studied through FEA. Before modeling, it was assumed that: (1) The upper surface of film is a flat plane, no matter what the substrate surface roughness is; (2) All kinds of peaks on the substrate surface in a model with the same Ra s are represented by isosceles triangles with the same dimension; (3) There are no defects, such as pores, voids, and cracks etc., in the film-substrate system in any case; (4) The physical properties of materials are kept constant during FEA; (5) The materials of film and substrate are isotropic. On the basis of the assumptions, a simplified 2D model was defined for studying the effects of such factors as deposition temperature, film thickness, and Ra s , on the first principal stress, as shown in Fig.…”

Section: Modelingmentioning

confidence: 99%

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Finite element analysis of stress in contacting zone of film and substrate

Han

Zhou

2009

Surface and Coatings Technology

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Section: Modelingmentioning

confidence: 99%

“…The thermal [1], mechanical [2,3], optical [4,5] and chemical properties [3] etc., of the specimen could be improved by depositing films on the surface. The mechanical property is very important for a film-substrate system, because the film could take effect only if the film-substrate system remains bonded.…”

Section: Introductionmentioning

confidence: 99%

Finite element analysis of stress in contacting zone of film and substrate

Han

Zhou

2009

Surface and Coatings Technology

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“…Evolution of microstructural features of the YSZ layer and its crystallographic texture in terms of the various parameters associated with EB-PVD process has been studied by several investigators [8,[10][11][12][13][14][15][16][17][18][19]. The important among these parameters are vapour incidence angle (VIA)˛, substrate rotation speed and substrate pre-heat temperature.…”

Section: Introductionmentioning

confidence: 99%

Microstructure, Texture and Thermal Cycling Performance of EB-PVD TBCs Deposited under Different Processing Conditions

Das¹,

Lakshmi²,

Rao³

et al. 2011

High Temperature Materials and Processes

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The microstructure, texture and thermal cycling life of a thermal barrier coating (TBC) deposited by electron beam physical vapour deposition method under several combinations of substrate pre-heat temperature and rotation speed, have been examined. The yttria stabilized zirconia ceramic coating of the TBC deposited on stationary samples predominantly showed h111i texture, although other texture components such as h220i and h311i were also present. The coatings on the rotated samples exhibited a predominant h100i texture. The h111i texture component was also present in these coatings in varying degrees. The intensity of h111i texture component in the coatings on the rotated samples decreased by increasing the substrate pre-heating temperature. The coating microstructures obtained under various processing conditions were consistent with the previously reported microstructures. No conclusive trend in the effect of texture present in the thermal barrier coatings on their thermal cycling life was observed in this study.

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“…The technical significance of texture investigation derives from the crystal anisotropy, such as the elastic module and thermal expansion coefficient (CTE) and so on. Considering the columnar growth pattern of films and EB-PVD process characteristics, differences in crystallographic texture are mainly attributed to the growth direction of columns and substrate temperature [5,6]. Columnar growth direction points to the source of incoming vapor flux and crystallites along different directions grow at different rates.…”

Section: Introductionmentioning

confidence: 99%

Investigation on Residual Stress and Crystallographic Texture of YSZ Films Prepared by EB-PVD

Meng

Sun

et al. 2007

KEM

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Yttria Stabilized Zirconia (YSZ) films were prepared by electron beam physical vapor deposition (EB-PVD) technique with a high deposition rate up to 1μm/min. An improved sin2ψ method was employed to analyze the residual stress of films by means of grazing incidence X-ray diffraction (GIXRD). The result of residual stress measurement reveals that residual stress of YSZ film is compressive stress and keeps a linear relationship with the deposition temperature, which is induced mainly by the thermal expansion mismatch between the film and substrate. The XRD result of films, prepared with different incident angles, demonstrates that the films show preferred orientation evidently. Furthermore, a parameter ωhkl was introduced from the inverse polar figure measurement theory to reveal the degree of preferred orientation clearly. The calculating result of ωhkl value indicates that the preferred orientation of different specimens changes with the incident angles, which is due to columnar growth pattern of films prepared by EB-PVD. In order to characterize the crystallographic texture visually, XRD with 2D detector system was used to analyze the texture of films. The result shows that Debye rings appear asymmetric intensively, which denotes the existence of preferred orientation directly and agrees with the calculating result of ωhkl value.

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Crystallographic texture of EB-PVD TBCs deposited on stationary flat surfaces in a multiple ingot coating chamber as a function of chamber position

Cited by 13 publications

References 9 publications

Finite element analysis of stress in contacting zone of film and substrate

Finite element analysis of stress in contacting zone of film and substrate

Microstructure, Texture and Thermal Cycling Performance of EB-PVD TBCs Deposited under Different Processing Conditions

Investigation on Residual Stress and Crystallographic Texture of YSZ Films Prepared by EB-PVD

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