Polycrystalline silicon (poly-Si) has been obtained for the first time as a result of an electron beam irradiation of amorphous hydrogenated silicon suboxide films with a stoichiometric coefficient of 0.5 (a-SiO0.5:H) and a thickness of 580 nm. The accelerating voltage of the electron beam was 2000 V, and the beam current was 100 mA. Raman spectra of silicon films after annealing are obtained depending on the time of electron beam irradiation of the initial material. It is shown that as a result of annealing, poly-Si is formed, the stress in which varied from compression to tension depending on the time of exposure.