2015
DOI: 10.1007/s13391-014-4254-8
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Crystalline silicon thin-film solar cells on ceramic substrates

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Cited by 8 publications
(3 citation statements)
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“…Ultra-thin c-Si solar cells (having absorber layer of sub-10 μ m) offer versatile benefit for energy harvesting. This technology has the potential to provide better stability and higher efficiency at low cost 1 , 2 . Through layer transferring, ultra-thin c-Si photovoltaics (PV) provides a path towards shrinking the material consumption cost by allowing multiple utilization of the substrate 3 , which currently accounts for 40% of the module cost 4 .…”
Section: Introductionmentioning
confidence: 99%
“…Ultra-thin c-Si solar cells (having absorber layer of sub-10 μ m) offer versatile benefit for energy harvesting. This technology has the potential to provide better stability and higher efficiency at low cost 1 , 2 . Through layer transferring, ultra-thin c-Si photovoltaics (PV) provides a path towards shrinking the material consumption cost by allowing multiple utilization of the substrate 3 , which currently accounts for 40% of the module cost 4 .…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, changes in doping levels during growth may also be caused by the cooling process. [106] When considering the epitaxy from a gas precursor, hightemperature approaches (between 800 and 1200 °C), such as chemical vapor deposition (CVD) [108,109] (see Figure 12a), are commonly used because thermal activation helps incoming Si atoms to settle in crystalline sites. However, high-temperature methods face a number of challenges, including high thermal budget, dopant diffusion, thermal mismatch, and incompatibility with lowcost substrates.…”
Section: "Bottom-up" Approachesmentioning
confidence: 99%
“…Based on the melt‐assisted epitaxial growth (see Figure a), wafer equivalent techniques such as string ribbon growth have been studied, [ 101–103 ] where the central part of the ribbon produces a large number of dislocations (see Figure 11b) [ 104 ] and twin boundaries. [ 101 ] In addition, there are methods based on liquid‐phase epitaxy (LPE) [ 105,106 ] as shown in Figure 11c, such as the epi‐lift technique, which can grow a Si epitaxial layer on a c‐Si substrate with partial mask. [ 107 ] LPE growth rates range from a few microns/hour to tens of microns/hour and substrate temperatures range from 800 to 1000 °C.…”
Section: “Bottom‐up” Approachesmentioning
confidence: 99%