Crystal plasticity finite element modeling and simulation of diamond cutting of polycrystalline copper

Simulation and Experimental Study on the Surface Generation Mechanism of Cu Alloys in Ultra-Precision Diamond Turning

“…Previous studies have shown that the surface topography in the ultra-precision cutting of the Cu alloys is affected by the material microstructure, including the defects [26], the crystal structure [27], the composition [28], etc. The nanoscale surface topography and the cross-sectional profile of the machined Cu alloys measured by atomic force microscope (AFM) are shown in Figure 17.…”

Mechanisms of material-oriented ultraprecision diamond cutting

“…多晶金属由多个单晶晶粒和连接晶粒的晶界组成，其中单晶晶粒的尺寸大 多服从对数正态分布 [7][8] ，而晶体取向具有随机特性，在特定情况下具有织构特 性。由于不同晶粒内部激活的位错滑移系与加工表面的角度不同，并且位错滑 移的空间也不同，导致晶粒之间的加工变形行为存在短程各向异性特性，影响 加工表面质量的长程有序性 [9][10] [11,13].…”

Anisotropy-Related Machining Characteristics in Ultra-Precision Diamond Cutting of Crystalline Copper

“…To represent the crystal anisotropy, in the CPFE model the constructions of both single crystalline and polycrystalline copper specimens are based on the mapping of Euler angles derived from according EBSD characterization. The CPCM is adopted to describe the anisotropy of crystalline copper by developing a corresponding UMAT user subroutine in implicit analysis with the software ABAQUS [28,34], and the shear strain rate can be expressed as a ratedependent power-law proposed by Pan et al [35].…”

“…Liu et al specially designed nano-cutting platform embedded within SEM, and performed nano-cutting experiments of single crystalline silicon to study effects of crystal orientation and tool edge radius on the critical thickness for the brittle-to-ductile transition [27]. More recently, Wang et al performed in situ SEM micro-cutting experiments of polycrystalline copper to examine the obtained chip profile, which are further verified by corresponding numerical simulations [28]. However, most of the previous in situ SEM micro-cutting experiments were focusing on the realization of cutting operations in SEM, and there is rare attention paid to the understanding of material properties' influence on the in situ cutting process.…”

“…Liu et al performed CPFE simulations to successfully capture the influence of crystallographic orientation on the cutting force, chip morphology, and pile-up profile in cutting processes of single crystalline copper [30]. More recently, Wang et al presents CPFE modeling and simulations of orthogonal diamond cutting of polycrystalline copper and corresponding experimental validation, in which the crystallographic orientations of individual grains between simulations and experiments are the same with electron backscatter diffraction (EBSD) characterization and corresponding Euler angles mapping [22,28]. They also demonstrated a strong dependence of shearing deformation of single crystalline copper under orthogonal cutting on crystal anisotropy by CPFE simulations and experimental validation [31].…”