“…Thus, the fabrication yield of the large modular system can be improved, and the electromagnetic crosstalk or impact of some correlated errors, such as caused by the high energy background radiation [33][34][35], may be restricted to the module scale. In addition, for modular quantum devices with larger inter-module spatial-separation dis-tance, the vacant space between modules could be employed to increase the control footprint area for qubit control, and could even be used to integrate on-chip control electronics [15,17,19,36]. This allows for a more-compact integration of the qubit device and its classical control system, thus potentially mitigating the wiring problem [7,8].…”