Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC

High speed interfaces in traditional Printed Circuit Board based systems are based on serial data communication circuits. Serializing and deserializing circuitries are used on two ends of the chips communicating with each other. The channel can be either between modules over a Backplane, between chip packages on PCB or between dies on an interposer. Backplane and PCB based serial communication has been studied extensively in the literature. But serial data communication analysis between dies in a 2.5D integrated system is yet to be thoroughly analyzed. This paper discusses the channel consisting of interposer lines, and the connection of dies to interposer using copper pillars. It performs the channel extraction using 2D and 3D solvers and describes the channel models. Then it shows the channel simulation results at 10Gb/s data rate using serial circuit models. Finally conclusions are discussed which would enable a better understanding of serial communication in a 2.5D integrated system

show abstract

Interposer based integration to achieve high speed interfaces for ADC application

Chaudhary

Heinig

Dittrich

2016

2016 IEEE International 3D Systems Integration Conference (3DIC)

View full text Add to dashboard Cite

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

hi@scite.ai

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC

Cited by 1 publication

References 6 publications

Interposer based integration to achieve high speed interfaces for ADC application

Interposer based integration to achieve high speed interfaces for ADC application

Contact Info

Product

Resources

About