Crosstalk included eye diagram estimation of high-speed and wide I/O interposer channel for 2.5D / 3D IC

Abstract

In this paper, crosstalk included eye diagram of high-speed and wide I/O interposer channels are simulated and analyzed. To analyze the crosstalk effect of various substrate channels, silicon, glass, and organic interposers are simulated and compared under the same physical dimensions. In addition, crosstalk included eye diagrams are accurately estimated in short time using 8 worst case input signals. The estimated eye diagrams are investigated at data rate of 10 Gbps.