1991
DOI: 10.1007/bf01130180
|View full text |Cite
|
Sign up to set email alerts
|

Crosslink density and fracture toughness of epoxy resins

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

15
186
0
4

Year Published

1996
1996
2015
2015

Publication Types

Select...
8
1

Relationship

0
9

Authors

Journals

citations
Cited by 235 publications
(205 citation statements)
references
References 14 publications
15
186
0
4
Order By: Relevance
“…This type of morphology was previously observed by us in materials obtained with 1-methylimidazole, which cured very fast as is also the case here [30]. The T g measured for this thermoset does not indicate plasticization, related to ductility, that dictate its toughness characteristics [31]. However, the rougher surface appearance observed in the fractographs containing HBP-OH blends, suggests that the impact specimens experienced more plastic deformation during fracture in comparison with the unmodified epoxy network.…”
Section: Mechanical and Morphological Characterizationsupporting
confidence: 49%
“…This type of morphology was previously observed by us in materials obtained with 1-methylimidazole, which cured very fast as is also the case here [30]. The T g measured for this thermoset does not indicate plasticization, related to ductility, that dictate its toughness characteristics [31]. However, the rougher surface appearance observed in the fractographs containing HBP-OH blends, suggests that the impact specimens experienced more plastic deformation during fracture in comparison with the unmodified epoxy network.…”
Section: Mechanical and Morphological Characterizationsupporting
confidence: 49%
“…Varying the molecular weight between cross-links has been linked to toughening in both mode I fracture and impact resistance. [28][29][30][31] However, the use of high-molecular-weight epoxy resins with low epoxide functionality presents challenges in processing as increasing the molecular weight before curing results in solid epoxy resins that requires high processing temperatures or the use of organic solvents. Additionally, increasing the molecular weight between cross-links can dramatically reduce the glass transition temperatures of the resulting thermosets, limiting their use in high-performance applications.…”
Section: Introductionmentioning
confidence: 99%
“…Different factors may influence the curing process, such as the temperature profile, time, epoxy/hardener ratio, and additives. [6,7] DSC is a technique commonly used to characterize the cure kinetics based on heat evolution and activation energies. Conversion studies resulting from isothermal and dynamic DSC experiments can quantitatively define the formation of the epoxy network.…”
Section: Communicationmentioning
confidence: 99%