Critical thickness for cracking of Pb(Zr0.53Ti0.47)O3 thin films deposited on Pt/Ti/Si(100) substrates

Zhao, Minghao; Fu, Ruibiao; Lu, Douding; Zhang, T.-Y.

doi:10.1016/s1359-6454(02)00254-9

Cited by 59 publications

(37 citation statements)

References 43 publications

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“…These stresses are smaller than those calculated for thermal mismatch of the PZT and substrate at room temperature. This stress relaxation has been noted in other works [39]. The variation of residual stress affects many aspects of generator performance including compliance, strain at failure and resonance frequency.…”

Section: Bulge Testing Resultssupporting

confidence: 71%

Development of experimental verification techniques for non-linear deformation and fracture.

Moody¹,

Bahr

2003

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This project covers three distinct features of thin film fracture and deformation in which the current experimental technique of nanoindentation demonstrates limitations. The first feature is film fracture, which can be generated either by nanoindentation or bulge testing thin films. Examples of both tests will be shown, in particular oxide films on metallic or semiconductor substrates. Nanoindentations were made into oxide films on aluminum and titanium substrates for two cases; one where the metal was a bulk (effectively single crystal) material and the other where the metal was a 1 pm thick film grown on a silica or silicon substrate. In both cases indentation was used to produce discontinuous loading curves, which indicate film fracture after plastic deformation of the metal. The oxides on bulk metals fractures occurred at reproducible loads, and the tensile stress in the films at fracture were approximately 10 and 15 GPa for the aluminum and titanium oxides respectively. Similarly, bulge tests of piezoelectric oxide films have been carried out and demonstrate film fracture at stresses of only 100's of MPa, suggesting the importance of defects and film thickness in evaluating film strength.The second feature of concern is film adhesion. Several qualitative and quantitative tests exist today that measure the adhesion properties of thin films. A relatively new technique that uses stressed overlayers to measure adhesion has been proposed and extensively studied. Delamination of thin films manifests itself in the form of either telephone cord or straight buckles. The buckles are used to calculate the interfacial fracture toughness of the film-substrate system. Nanoindentation can be utilized if more energy is needed to initiate buckling of the film system.Finally, deformation in metallic systems can lead to non-linear deformation due to "bursts" of dislocation activity during nanoindentation. An experimental study to examine the structure of dislocations around indentations has been carried out to demonstrate the effectiveness in evaluating cross slip and dislocation behavior around nanoindentation impressions in bulk engineering alloys.iii This page intentionally left blank

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Section: Bulge Testing Resultssupporting

confidence: 71%

Development of experimental verification techniques for non-linear deformation and fracture.

Moody¹,

Bahr

2003

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“…This is because cracking in thick films releases a greater proportion of stored elastic energy meaning that cracking is favoured in thicker constrained film systems. This phenomenon was also observed in the films produced using other deposition techniques such as spin coating [32,33].…”

Section: Ball-milling Of Pzt Powdersupporting

confidence: 57%

“…9. The highest d 33 33 and ε r obtained in this work are still lower than the bulk PZT material (Pz26). This is mainly due to the existence of residual pores and cracks, and different grain 8 sizes in the film as well as the presence of the rigid substrate constraining the film.…”

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confidence: 51%

Electrohydrodynamic jet printing of PZT thick film micro-scale structures

Wang

Zhu

Liang

et al. 2015

Journal of the European Ceramic Society

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© 2015 Elsevier Ltd. This paper reports the use of a printing technique, called electrohydrodynamic jet printing, for producing PZT thick film micro-scale structures without additional material removing processes. The PZT powder was ball-milled and the effect of milling time on the particle size was examined. This ball-milling process can significantly reduce the PZT particle size and help to prepare stable composite slurry suitable for the E-Jet printing. The PZT micro-scale structures with different features were produced. The PZT lines with different widths and separations were fabricated through the control of the E-Jet printing parameters. The widths of the PZT lines were varied from 80μm to 200μm and the separations were changed from 5μm to 200μm. In addition, PZT walled structures were obtained by multi-layer E-Jet printing. The E-Jet printed PZT thick films exhibited a relative permittivity (er) of ~233 and a piezoelectric constant (d33, f) of ~66pCN^-1

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“…This effective value is a result of the difference in thermal expansion between paraelectric PZT and substrate above the Curie temperature ͑ϳ300°C 6 ͒ and between ferroelectric PZT and substrate below this temperature. Since the thermal expansion coefficient for Si ϳ5 ppm and for paraelectric PZT ϳ6.1 ppm, 6 an effective value of ϳ11 ppm results for the ferroelectric PZT. Further insight can be gained via a x-ray diffraction measurement at elevated temperatures.…”

mentioning

confidence: 99%

“…Lead zirconate titanate ͑PZT͒ films are being used in electronic devices and microelectromechanical systems, where the reliability depends on the residual stresses in the film. 5,6 A surface stress of 117 MPa after cooling from 650°C to room temperature has been determined using x-ray diffraction for PZT films ͑1 m thick, suffix 1͒ on Si substrates ͑525 m thick, suffix 2͒. 5,6 A calculation of the stresses using the relationships presented above yields then 2,surface ϭ0.4 MPa, 2,interface ϭϪ0.9 MPa and 1,interface ϭ117 MPa.…”

mentioning

confidence: 99%

Stress profile and thermal expansion of layered materials determined from surface stresses

Malzbender¹

2004

Applied Physics Letters

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A simple method of inferring the stress profile and the effective difference in thermal expansion or strain in an unconstrained elastic multilayer system from a measurement of a limited number of surface stresses as obtained for example using x-ray diffraction or Raman spectroscopy is outlined. Explicit relationships are given for bilayered systems. The analysis procedure is exemplified for literature data of electronics materials, solid oxide fuel cells and thermal barrier systems. Following the outlined procedure, a determination of the stress profile and difference in thermal expansion for composites of alternating layers is also possible. © 2004 American Institute of Physics. ͓DOI: 10.1063/1.1759773͔ Layered materials find widespread use in electronic, magnetic, optical, and structural components. Such components can be subjected to residual stresses due to intrinsic processes, such as sintering or crystallization, mismatch in thermal expansion coefficient or mechanical loading. Theories to relate stress, strain and curvature to the mechanical and thermal loading have been established for isotropic materials, bilayered, 1 multilayered composites 2 and materials with property gradients.3 These theories can be used to determine the difference in strain or thermal expansion as well as the residual stresses in a layered composite from the change in deflection or curvature.Residual stresses in the surface of coated and layered materials are often assessed using Raman spectroscopy or x-ray diffraction.4,5 However, a determination of the stress profile requires a large number of measurements. In the current letter it is shown how the stress profile can be determined from a limited number of measurements. Only the more common cases of bilayer ͑coating on a substrate͒ and trilayer composites are analyzed in detail. However, following the outlined procedure the stress profile and thermal expansion for composites of alternating layers can be determined.It is assumed that the stress is measured in the surface of layer 1. It has to be considered that the stress is only representative of the surface if the analyzed depth is small compared to the layer thickness or the stress is relatively constant over the layer thickness, which is the case if the film thickness is much smaller than the substrate thickness. All stresses are in the plane of the laminate. The stress in the surface of layer 2, 2,surface , in layer 2 next to the interface to layer 1, 2,interface , and in layer 1 next to the interface to layer 2, 1,interface , follow from the general relationships for the stress in multilayered composites where t is the thickness and E the elastic modulus ͑if the specimen is a plate E/(1Ϫ 2 ) has to be substituted͒. Since the stress can be a result of differences in thermal expansion but also intrinsic, growth related, the difference in strain is considered. If the strain is a result of thermal expansion ⑀ ϭ␣⌬T and ⌬⑀ϭ⌬␣⌬T. Defining the strain in layer two as ⑀ 2 ϭ⑀ 1 ϩ⌬⑀ 1,2 yieldsHere E and t are the average values during th...

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Critical thickness for cracking of Pb(Zr0.53Ti0.47)O3 thin films deposited on Pt/Ti/Si(100) substrates

Cited by 59 publications

References 43 publications

Development of experimental verification techniques for non-linear deformation and fracture.

Development of experimental verification techniques for non-linear deformation and fracture.

Electrohydrodynamic jet printing of PZT thick film micro-scale structures

Stress profile and thermal expansion of layered materials determined from surface stresses

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