2015
DOI: 10.1016/j.nimb.2015.07.045
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Critical process temperatures for resistive InGaAsP/InP heterostructures heavily implanted by Fe or Ga ions

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Cited by 4 publications
(3 citation statements)
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“…An average concentration of 2.3 × 10 20 cm −2 Fe ions over the entire thickness of the InGaAs layer is obtained by summing all the implantation profiles. At such high doses, the InGaAs film is completely amorphized [11][12][13]. The ion-implanted films were then processed by RTA at five different temperatures: 300, 400, 500, 600 and 700 • C. The thermal annealing was performed under nitrogen atmosphere using GaAs proximity capping to prevent As desorption from the sample surface during annealing.…”
Section: Methodsmentioning
confidence: 99%
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“…An average concentration of 2.3 × 10 20 cm −2 Fe ions over the entire thickness of the InGaAs layer is obtained by summing all the implantation profiles. At such high doses, the InGaAs film is completely amorphized [11][12][13]. The ion-implanted films were then processed by RTA at five different temperatures: 300, 400, 500, 600 and 700 • C. The thermal annealing was performed under nitrogen atmosphere using GaAs proximity capping to prevent As desorption from the sample surface during annealing.…”
Section: Methodsmentioning
confidence: 99%
“…The presence of these peaks results from the formation of a polycrystalline phase of InGaAs after RTA. Indeed, the recrystallization of implanted films occurs through the formation of coherent crystalline domains (grains) [12,13]. The total broadening of each XRD peak can be expressed as β exp = β hkl + β ins , where β hkl is the full-width at half maximum of the hkl peak and β ins is the instrument's broadening function.…”
Section: X-ray Diffractionmentioning
confidence: 99%
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