Creep behavior of submicron copper films under irradiation

Lapouge, Pierre; Onimus, F.; Coulombier, Michaël; Raskin, J.-P.; Pardoen, Thomas; Bréchet, Y.

doi:10.1016/j.actamat.2017.03.056

Cited by 13 publications

(1 citation statement)

References 48 publications

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“…An alternative approach is to use heavy ions, which better simulate the neutron damage and do not activate the matter, but have an even more limited penetration than light ions. Despite the efforts of few research teams to use miniaturized specimen coupled with heavy ion beams [7,8,9,10,11,12,13,14,15], the access to the underlying irradiation creep mechanisms remains indirect. The in-situ imaging of crystal defects under both straining and heavy ion irradiation inside a TEM can allow for a direct access to the active mechanisms [16].…”

Section: Introductionmentioning

confidence: 99%

In-situ TEM irradiation creep experiment revealing radiation induced dislocation glide in pure copper

et al. 2021

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In-situ straining experiments were performed on pure copper to investigate dislocation motion under heavy ion irradiation at high stress levels. The unpinning of dislocations from irradiation defects followed by glide was observed under irradiation at stress level just below the critical stress for dislocation glide without irradiation. This phenomenon was unraveled for the first time in copper. The dislocation dynamics recorded in-situ was statistically analyzed using digital image processing to determine the pinning lifetime. Quantitative analysis of pinning lifetimes have been performed, suggesting that a cascade related mechanism is operative to explain the fast dislocation glide under irradiation. This work provides a new insight on the irradiation creep deformation at high stress level.

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