“…Secondly, in order to import the scanned images to MIMICS ® software for further process, images with high resolutions were required. Since the resolution of the images which have been obtained through experiment was not high enough, a program was written in the MATLAB ® software to increase the resolution of all images [14][15]. The quality of the images after image processing increased significantly, Figures 2, 3.…”
Limitations in the packaging industry require improvements in lead‐based microelectronics, because regulations restricting hazardous substances have ended the use of conventional lead‐based solders. Sintered silver paste presents an alternative method for bonding chips to a substrate because it has low sensitivity to the oxidation, high melting point, and improved thermal and electrical conductivity. Due to the sintering process, however, the silver exhibits a significant pore fraction that substantially reduces the density of the material compared to bulk silver. The traits of the sintered silver pastes are affected by the pore distribution; hence, it can be considered as a significant factor in modelling the behaviour of the whole electronic system under operating conditions. This study defines the influence of the morphology and pore distribution on the response of the silver material. The quality of tomographic images was improved through coding a program in MATLAB®. Finite element software ABAQUS® was employed to evaluate the elastic properties of the material. To validate the model, the results have gone through several studies to determine changes of the material properties.
“…Secondly, in order to import the scanned images to MIMICS ® software for further process, images with high resolutions were required. Since the resolution of the images which have been obtained through experiment was not high enough, a program was written in the MATLAB ® software to increase the resolution of all images [14][15]. The quality of the images after image processing increased significantly, Figures 2, 3.…”
Limitations in the packaging industry require improvements in lead‐based microelectronics, because regulations restricting hazardous substances have ended the use of conventional lead‐based solders. Sintered silver paste presents an alternative method for bonding chips to a substrate because it has low sensitivity to the oxidation, high melting point, and improved thermal and electrical conductivity. Due to the sintering process, however, the silver exhibits a significant pore fraction that substantially reduces the density of the material compared to bulk silver. The traits of the sintered silver pastes are affected by the pore distribution; hence, it can be considered as a significant factor in modelling the behaviour of the whole electronic system under operating conditions. This study defines the influence of the morphology and pore distribution on the response of the silver material. The quality of tomographic images was improved through coding a program in MATLAB®. Finite element software ABAQUS® was employed to evaluate the elastic properties of the material. To validate the model, the results have gone through several studies to determine changes of the material properties.
“…Apart from fillers, some research has analyzed the possible bio-composites applications. An example is the work by Ghoushji et al [ 126 ], which investigated the crashworthiness properties of ramie/bio-epoxy composite square tubes with different lengths, and assessed their suitability as potential energy absorbing components. From static axial compression tests, the best properties in terms of average load and specific energy absorption (SEA) were observed for short tubes, and a significant improvement in SEA was detected as the number of layers increased.…”
This study comprehensively examines recent developments in bio-epoxy resins and their applications in composites. Despite the reliability of traditional epoxy systems, the increasing demand for sustainability has driven researchers and industries to explore new bio-based alternatives. Additionally, natural fibers have the potential to serve as environmentally friendly substitutes for synthetic ones, contributing to the production of lightweight and biodegradable composites. Enhancing the mechanical properties of these bio-composites also involves improving the compatibility between the matrix and fibers. The use of bio-epoxy resins facilitates better adhesion of natural composite constituents, addressing sustainability and environmental concerns. The principles and methods proposed for both available commercial and especially non-commercial bio-epoxy solutions are investigated, with a focus on promising renewable sources like wood, food waste, and vegetable oils. Bio-epoxy systems with a minimum bio-content of 20% are analyzed from a thermomechanical perspective. This review also discusses the effect of incorporating synthetic and natural fibers into bio-epoxy resins both on their own and in hybrid form. A comparative analysis is conducted against traditional epoxy-based references, with the aim of emphasizing viable alternatives. The focus is on addressing their benefits and challenges in applications fields such as aviation and the automotive industry.
“…There are a variety of micro-scale fillers reported in the literature for epoxy polymers. The examples include natural ramie, glass fiber, seeds, glass fabric, etc. As an alternative, nanoscale fillers like carbon derivatives, − nano-clay, nano-silica, alumina, etc., have also been used to reinforce epoxy polymers.…”
Epoxies, their derivatives, and composites,
due to superior
specific
strength, are preferred for many potential applications in the field
of automobiles, aircraft, bonding of structures, protective coatings,
water filtration, etc. As structural members in automobiles and aircraft,
the epoxy-based components are exposed to various static/dynamic mechanical
loading conditions during their service life. The interfacial interactions,
between the matrix and reinforcement, greatly affect the final properties
of the composites. The present study demonstrates that the solvent
used for the preparation of the composite can also contribute toward
interfacial interactions. Present research systematically finds out
a suitable solvent (acetone) and reinforcement type [multi-walled
carbon nanotube (CNT)] for epoxy [bisphenol-A (BPA)] nanocomposites.
Dynamic and static strengths of the as-prepared epoxy–CNT nanocomposites
were carefully investigated. Well dispersed CNTs in acetone were mixed
with an ester of BPA under constant magnetic stirring conditions.
Samples of tablet shape were prepared for testing static and dynamic
performance of the composite using a nano-indentation technique. Considerable
enhancement by 55 and 22% in the static elastic modulus and hardness
of BPA–CNT composites, respectively, was observed (compared
with that of pristine BPA). The storage modulus and tan-delta of the
nanocomposites were also improved by 14 and 46%, respectively. Improved
static and dynamic performance, reported in this work, significantly
enhances the scope of utilization of BPA–CNT-based nanocomposites
under severe static and dynamic loading conditions simultaneously.
Static and dynamical analysis of CNT-reinforced epoxy provides more
realistic understanding of the mechanical performance of the nanocomposite.
Density functional theory (using QuantumATK software) simulations
were performed to investigate and identify the alterations in the
atomic morphology of CNTs during interfacial interaction with the
acetone molecule and epoxy matrix. The calculations predicted that
CNTs with mild defects as compared to pristine CNTs were better suited
for synthesis of the nanocomposite and also assisted in a homogeneous
distribution of CNTs in BPA without aggregation (with acetone as the
solvent). Furthermore, structural changes in CNTs after treatment
with BPA and the curing agent and the role of defects are studied
in detail.
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