CPW-to-Stripline Vertical via Transitions for 60ghz LTCC Sop Applications

Lee, Young Chul

doi:10.2528/pierl07122805

Cited by 34 publications

(27 citation statements)

References 9 publications

(10 reference statements)

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“…In these cases, signal vias behave similarly to a lowpass filter, attenuating high-frequency components [13][14][15][16][17][18]. Fig.…”

Section: Differential Aperture-coupled Patch Antennamentioning

confidence: 99%

LTCC Differential-Fed Patch Antennas With Rat-Race Feeding Structures

Chin

Liu²,

Chang³

et al. 2012

PIER C

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Abstract-This paper presents differential-fed patch antennas with excellent cross-polarization. This paper provides a detailed graphic illustration of factors that lead to deteriorated H-plane crosspolarization by the conventional single-ended feeding probes. A novel differential rat-race feeding structure was constructed to allow easy impedance matching. An experimental antenna was realized on lowtemperature co-fired ceramic (LTCC) at 8 GHz. An excellent crosspolarization of less than −22.5 dB was achieved. When the operation frequency is high, the parasitic inductance caused by feeding probes may degrade the performance of antennas. This paper further proposes the use of differential aperture-coupled structures at high frequencies. An aperture-coupled antenna realized at 40 GHz with low crosspolarization < −15 dB has been achieved.

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“…In these cases, signal vias behave similarly to a lowpass filter, attenuating high-frequency components [13][14][15][16][17][18]. Fig.…”

Section: Differential Aperture-coupled Patch Antennamentioning

confidence: 99%

LTCC Differential-Fed Patch Antennas With Rat-Race Feeding Structures

Chin

Liu²,

Chang³

et al. 2012

PIER C

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“…As a consequence, the signal switching frequency across a broad range of electronic packaging technologies including system-on-chip (SoC) and system-on-package (SoP) is far beyond the gigahertz range. When the bandwidth requirement increases, the electrical properties of the interconnect affect and limit the integrity of the traveling digital signals [1][2][3][4][5]. These phenomena also have an impact on the electromagnetic compatibility (EMC) performance of the system since the corrupted signals can easily increase the unwanted electromagnetic interference (EMI).…”

Section: Introductionmentioning

confidence: 99%

Methods and Designs for Improving the Signal Integrity of Vertical Interconnects in High Performance Packaging

Wu¹,

Lo²

2012

PIER

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Abstract-Design of high performance package interconnects using full-wave electromagnetic solvers is necessary due to increased operation speed, miniaturization and vertical 3D integration. Thus the segmented study and optimization is becoming inevitable for designers to improve the signal integrity of IC packaging. This paper addresses alternative methods and optimal designs on several components and structures for package electrical interconnects, including voiding technique, padless via implementation, spiral micro-via stacking and signal/ground layout pin patterns. The simulation results have been presented to demonstrate the improvements of optimized schemes. These methodologies could be treated as handy references and general guidelines applicable to different package designs and could result in significant improvements of overall package signal integrity performance.

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“…Generally, vias are highly utilized in vertical interconnection structures of high-density system-on-package substrates [23][24][25][26]. Field discontinuity may deteriorate the frequency response of filters when signals travel through vias, since the induced parasitic inductance behaves akin to a low-pass filter, attenuating high-frequency components.…”

Section: Fold-back Structurementioning

confidence: 99%

LTCC Fold-Back Bandpass Filter Designed With Capacitively Loaded Stubs

Chin

Hung²,

Huang³

et al. 2011

PIER C

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Abstract-This study presents a design of a compact stub-type bandpass filter with capacitively loaded stubs and a fold-back structure. This paper employed the fabrication process of lowtemperature co-fired ceramic (LTCC) for filter realization of a multilayer structure. The proposed filter structure required adding end capacitors to stubs to extend their electrical length, while achieving a length reduction of 30%. This study provided design curves to determine the dimensions of the end capacitor for reaching maximum electrical length extension. In addition, a fold-back configuration was applied to halve the filter size. An experimental filter operating at 5.8 GHz was fabricated and measured to validate the design concept, achieving a highly compact size of 14.3 × 8.2 × 0.76 mm 3 .

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CPW-to-Stripline Vertical via Transitions for 60ghz LTCC Sop Applications

Cited by 34 publications

References 9 publications

LTCC Differential-Fed Patch Antennas With Rat-Race Feeding Structures

LTCC Differential-Fed Patch Antennas With Rat-Race Feeding Structures

Methods and Designs for Improving the Signal Integrity of Vertical Interconnects in High Performance Packaging

LTCC Fold-Back Bandpass Filter Designed With Capacitively Loaded Stubs

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