Coupled Acoustic and Heat Transfer Modeling of a Synthetic Jet

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

2010

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Many novel thermal management technologies have been developed to ameliorate the losses from modern electronics. As these techniques are developed, designers endeavor to compare each method with existing concepts. However, many of these comparative metrics can be system-dependent, leading to inconclusive results. One of the most common metrics, the thermal resistance, is a simple relationship between the total heat transfer from a device and its temperature rise above a reference condition. However, the thermal resistance metric has several issues that can limit its utility in comparing systems, particularly due to its dimensional nature and consequent dependence on system size. In addition, this metric does not include any information about the amount of power required for cooling a system. To improve comparisons, a non-dimensional volumetric coefficient of performance is proposed, accounting for issues such as thermal performance, system extent, and input power requirement. This new parameter is compared with other common metrics in the examination of two promising contemporary cooling solutions: synthetic jet air cooling and microchannel liquid cooling.

Section: Enhancement Factormentioning

confidence: 99%

Understanding the performance metrics for advanced cooling methodologies

Solovitz

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

2010

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“…Maximum heat transfer augmentation over natural convection was found to be approximately 10 from a 12.54 mm vertical-thinheated surface. Development of an analytical model to study the coupled structural dynamics, acoustic and heat transfer physics of synthetic jets, based on Helmholtz resonators, was lately presented [12]. The underlying physical behavior of the parameters that govern the jet's performance was investigated and trade-off studies were performed.…”

Section: Introductionmentioning

confidence: 99%

Experimental study on convection heat transfer of a single fin duct with pulsated airflow

2010 3rd International Conference on Thermal Issues in Emerging Technologies Theory and Applications

2010

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With the recent advancements in the electronics industry, thinner systems with greater functionality are on demand. Natural convection air-cooling is the method of choice for many low power electronics applications due to cost, availability, and reliability. However, its performance is very limited due to buoyancy dependent weak flow. Therefore, there is a need for further enhancement of natural convection. An experimental study is performed to understand the synthetic jet heat transfer over a single fin surface. The primary focus is for the understanding of the local temperatures and heat transfer coefficients on the fin surface. We used microscopic infrared temperature measurement technique to understand local temperatures leading to local convective cooling. Heat transfer is correlated to pulsation frequency, air velocity, duct width, flow angle, fin spacing, and jet orifice size. The results show that heat transfer can be improved by increasing air velocity and pulse rate. Smaller fin spacing can cause increase of heat transfer coefficient. Airflow impinging on one fin with angle can enhance heat transfer in the local area, but not for the fin duct as a whole. Strong heat transfer is observed close to the inlet and exit of the duct.

“…Development of an analytical model to capture the coupled structural dynamics, acoustic and heat transfer physics of synthetic jets, based on Helmholtz resonators, was recently presented [15]. The underlying physical behavior of the parameters that govern the jet's performance was investigated and trade-off studies were performed.…”

Section: Introductionmentioning

confidence: 99%

Augmenting forced convection heat transfer coupled with an aerodynamic surface and a synthetic jet

Salapakkam

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

et al. 2010

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Forced convection heat transfer is limited with the fan flow rate or pressure drop. Therefore, it is necessary to develop novel cooling technologies that can enhance forced convection. A new heat sink design is proposed for electronics cooling applications. The objective of this study was to develop a new heat sink design, which increases heat transfer properties while containing the pressure drop. Twodimensional CFD analysis was used to optimize the shape of the heat sink. Enhancing the heat transfer characteristics also increased the pressure drop and hence the fan power. It is observed that lower heat sink surface temperatures are highly non-linear and produce significantly larger pressure drops. A new aerodynamic heat sink shape is proposed by integrating aerodynamic flow characteristics and fan performance curves. The results show that a good compromise for higher heat transfer properties while marginally increasing the pressure drop is possible. However, we believe that further optimization of this technology will enable lower thermal resistance at the same pressure drop compared to baseline forced convection in the same flow rate.