2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2010
DOI: 10.1109/itherm.2010.5501395
|View full text |Cite
|
Sign up to set email alerts
|

Augmenting forced convection heat transfer coupled with an aerodynamic surface and a synthetic jet

Abstract: Forced convection heat transfer is limited with the fan flow rate or pressure drop. Therefore, it is necessary to develop novel cooling technologies that can enhance forced convection. A new heat sink design is proposed for electronics cooling applications. The objective of this study was to develop a new heat sink design, which increases heat transfer properties while containing the pressure drop. Twodimensional CFD analysis was used to optimize the shape of the heat sink. Enhancing the heat transfer characte… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 19 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?