“…Significant efforts are being made in the development of both antenna-on-chip (AoC) and antenna-in-package (AiP) solutions [1]. Owing to the limited performance and increased die cost of on-chip antennas, numerous AiP solutions realized in polytetrafluoroethylene (PTFE), glass cloth resin, low-temperature co-fired ceramics (LTCC) and liquid crystal polymer (LCP) susbtrates have recently been proposed in [2], [3], [4], and [5] respectively. In [2], [4], and [5] the antenna element has a broadside radiation pattern whereas Suga et.…”