“…Of course, the module-based approach potentially leads to greater manufacturing costs due to the requirements for handling, mounting, and connecting the different components, and may also suffer from lower reliability and lower manufacturing yields. However, based on the discussion in Reference [36], SoP currently tends to be the lower-cost solution overall, particularly when integration of high-Q passive elements and antennas is considered. However, such cost-benefits are not realized if the various RF, baseband, and data-conversion/DSP functional blocks are implemented as individual ICs within the module or package.…”