2004
DOI: 10.1109/tadvp.2004.828818
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Cost and Performance Tradeoff Analysis in Radio and Mixed-Signal System-on-Package Design

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Cited by 23 publications
(7 citation statements)
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“…Of course, the module-based approach potentially leads to greater manufacturing costs due to the requirements for handling, mounting, and connecting the different components, and may also suffer from lower reliability and lower manufacturing yields. However, based on the discussion in Reference [36], SoP currently tends to be the lower-cost solution overall, particularly when integration of high-Q passive elements and antennas is considered. However, such cost-benefits are not realized if the various RF, baseband, and data-conversion/DSP functional blocks are implemented as individual ICs within the module or package.…”
Section: Front-end-antenna Interface and Integration Issuesmentioning
confidence: 99%
“…Of course, the module-based approach potentially leads to greater manufacturing costs due to the requirements for handling, mounting, and connecting the different components, and may also suffer from lower reliability and lower manufacturing yields. However, based on the discussion in Reference [36], SoP currently tends to be the lower-cost solution overall, particularly when integration of high-Q passive elements and antennas is considered. However, such cost-benefits are not realized if the various RF, baseband, and data-conversion/DSP functional blocks are implemented as individual ICs within the module or package.…”
Section: Front-end-antenna Interface and Integration Issuesmentioning
confidence: 99%
“…Within different architecture domains of a MMR, there are methods to be used in the selection of technology. For example, in [4] a cost and performance tradeoff analysis is used to rank alternative ways to implement a WLAN receiver RF-and mixed-signal front end. In [5] a total cost approach is used to evaluate different reconfigurable architectures.…”
Section: Systems Analysis Approachmentioning
confidence: 99%
“…al [8] addresses the limitat ion of fault tolerance model by introducing the cost model fo r these by taking into account the reliability factor. Li-Rong Zheng [9] presents the review and analysis of cost performance trade-off system chip versus system on package. Methodology used is based on quantitatively analysis.…”
Section: Introductionmentioning
confidence: 99%