Corrosion-resistant metal layers from a CMOS process for bioelectronic applications

Birkholz, M.; Ehwald, K.‐E.; Wolansky, D.; Costina, I.; Baristiran-Kaynak, Canan; Fröhlich, Maik; Beyer, Hans; Kapp, Andreas; Lisdat, Fred

doi:10.1016/j.surfcoat.2009.09.075

Cited by 38 publications

(17 citation statements)

References 19 publications

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“…These properties enable TiN to be used in hard coatings, diffusion barriers, bio-inert coatings, cutting and drilling tools, in semiconductor devices [19], non-toxic exterior for medical implants [18,20] and as electrodes in bioelectronic applications [21]. The Ni-Fe/TiN nanocomposite coatings can find potential engineering application in mechanical and wear parts, cutting and drilling tools and in MEMS devices.…”

Section: Introductionmentioning

confidence: 99%

Structure and properties of electrodeposited functional Ni–Fe/TiN nanocomposite coatings

Tripathi

Singh

2015

Surface and Coatings Technology

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Section: Introductionmentioning

confidence: 99%

Structure and properties of electrodeposited functional Ni–Fe/TiN nanocomposite coatings

Tripathi

Singh

2015

Surface and Coatings Technology

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“…15-18 K for NbN and MoN) and they provide conductive diffusion barrier layers for electronics devices. The optical properties lead to coloured coatings for costume jewellery, and they have applications in catalysis [4][5][6][7][8][9][10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Nitrogen-rich transition metal nitrides

Salamat

Hector

Kroll

et al. 2013

Coordination Chemistry Reviews

124

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The solid state chemistry leading to the synthesis and characterization of metal nitrides with N:M ratios > 1 is summarized. Studies of these compounds represent an emerging area of research. Most transition metal nitrides have much lower nitrogen contents, and they often form with nonor sub-stoichiometric compositions. These materials are typically metallic with often superconducting properties, and they provide highly refractory, high hardness materials with many technological applications. The higher metal nitrides should achieve formal oxidation states (OS) attaining those found among corresponding oxides, and they are expected to have useful semiconducting properties. Only a very few examples of such high OS nitrogen-rich compounds are known at present. The main group elements typically form covalently bonded nitride ceramics such as Si 3 N 4 , Ge 3 N 4 and Sn 3 N 4 , and the early transition metals Zr and Hf produce Zr 3 N 4 and Hf 3 N 4 . However, the only main example of a highly nitrided transition metal compound known to date is Ta 3 N 5 , that has a formal oxidation state +5 and is a semiconductor with visible light absorption leading to applications as a pigment and in photocatalysis. New synthesis routes are being explored to study the possible formation of other N-rich materials that are predicted to exist by ab initio calculations. There is a useful interplay between theoretical predictions and experimental synthesis studies at ambient and high pressure conditions, as we explore and establish the existence and structure-property relations of these new nitride compounds and polymorphs. Here we review the state of current investigations and indicate possible new directions for further work.[a] European Synchrotron Radiation Facility,

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“…In these situations titanium nitride may be the material of choice, as it turned out remarkably corrosion‐resistant. Its corrosion‐resistance in biotechnological applications is expressed by negligible redox rates in cyclic voltammograms when TiN was used as working electrodes. Accordingly, TiN electrodes are applied in biomedical applications such as the artificial retina implant or IHP's glucose sensor chip . TiN should always be considered as the top‐most electrode material, when the electrodes are intended to interact with bio‐milieus.…”

Section: Preparation Technologies For Microelectronic Chipsmentioning

confidence: 99%

Technology modules from micro‐ and nano‐electronics for the life sciences

Birkholz

Mai

Wenger

et al. 2015

WIREs Nanomed Nanobiotechnol

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The capabilities of modern semiconductor manufacturing offer remarkable possibilities to be applied in life science research as well as for its commercialization. In this review, the technology modules available in micro- and nano-electronics are exemplarily presented for the case of 250 and 130 nm technology nodes. Preparation procedures and the different transistor types as available in complementary metal-oxide-silicon devices (CMOS) and BipolarCMOS (BiCMOS) technologies are introduced as key elements of comprehensive chip architectures. Techniques for circuit design and the elements of completely integrated bioelectronics systems are outlined. The possibility for life scientists to make use of these technology modules for their research and development projects via so-called multi-project wafer services is emphasized. Various examples from diverse fields such as (1) immobilization of biomolecules and cells on semiconductor surfaces, (2) biosensors operating by different principles such as affinity viscosimetry, impedance spectroscopy, and dielectrophoresis, (3) complete systems for human body implants and monitors for bioreactors, and (4) the combination of microelectronics with microfluidics either by chip-in-polymer integration as well as Si-based microfluidics are demonstrated from joint developments with partners from biotechnology and medicine. WIREs Nanomed Nanobiotechnol 2016, 8:355-377. doi: 10.1002/wnan.1367 For further resources related to this article, please visit the WIREs website.

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Corrosion-resistant metal layers from a CMOS process for bioelectronic applications

Cited by 38 publications

References 19 publications

Structure and properties of electrodeposited functional Ni–Fe/TiN nanocomposite coatings

Structure and properties of electrodeposited functional Ni–Fe/TiN nanocomposite coatings

Nitrogen-rich transition metal nitrides

Technology modules from micro‐ and nano‐electronics for the life sciences

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