Corrosion behavior of pure tin deposit under 55 °C/85 % RH reliability test

Yeh, Min-Chi; Li, Jyun Lin; Lo, Pei Jen; Yu, R.; Yu, C.Y.; Hsieh, Ker-Chang

doi:10.1007/s10854-013-1588-1

Cited by 4 publications

(5 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…5c was severely oxidized. At such a testing environment, the oxide of the tin film was confirmed as SnO 2 [10]. Figure 5e shows the cross-section of the corrosion area cut along the straight line by FIB in Fig.…”

Section: Grain Structure Of the Top Layermentioning

confidence: 96%

“…There are many factors that can contribute to the stress increase in the Sn finishes, such as IMC formation along grain boundaries [1,2,[4][5][6], CTE mismatch between Sn finish and substrate material during thermal cycling test [7][8][9], oxidation and corrosion [10,11]. It has been widely accepted that the Sn whisker growth is a stress-release phenomenon [1,4,8,10,12] Sn whisker growth mainly depends on the diffusion flow of internal atoms, which is a very slow process and also needs vacancy diffusion.…”

Section: Introductionmentioning

confidence: 99%

“…It has been widely accepted that the Sn whisker growth is a stress-release phenomenon [1,4,8,10,12] Sn whisker growth mainly depends on the diffusion flow of internal atoms, which is a very slow process and also needs vacancy diffusion. The self-diffusions of metal atom and vacancy are reversed.…”

Section: Introductionmentioning

confidence: 99%

“…Thus, rapid diffusion path of vacancies and Sn atoms depended on the internal grain boundary structure or the internal grain structure within the tin film. Moreover, grain structure could have great influence on the formation of IMC at the interface [6,10], which has great effect on stress distribution. Therefore, it is easy to understand that the internal grain structure of the Sn film could have great influence on the whisker growth.…”

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Tin whisker growth on electroplated Sn multilayers

Ding

Gong

2015

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

As one of the key reliability issues, tin whisker problem has perturbed the electronics industry for several decades. Developing an effective way to mitigate the growth of tin whiskers is of great importance. In this study, we develop a novel multilayer method through alternately plating bright Sn and matte Sn layers to control the tin whisker growth. The samples of bilayer, trilayer and quadlayer were fabricated and stored at 55°C/85 % relative humidity and room temperature to evaluate the whisker growth. Experimental results revealed that the tin whiskers tended to grow on the bilayer and trilayer samples with bright Sn as the top layer. The whiskers originated from the middle or bottom layer and broke through the top layer. Compared to the bottom layer of matte Sn, bright Sn as the bottom layer was prone to promote whisker growth, due to irregular formation of intermetallic compound. With increase of the number of Sn layers, the grain structure of bottom layer became the main factor to affect Sn whisker growth. Uniform thickness of individual Sn layers could help to reduce whisker density. Optimal Sn multilayers are obtained to be matte/bright/matte Sn and bright/matte/ bright/matte Sn with uniform thickness of individual layers.

show abstract

Section: Grain Structure Of the Top Layermentioning

confidence: 96%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Tin whisker growth on electroplated Sn multilayers

Ding

Gong

2015

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

show abstract

“…Test conditions of 55°C and 85% humidity were chosen to accelerate whisker growth based on the JEDEC standard [36,37] and previous investigations [38,39,15]. The effect of deposition parameters on whisker growth was evaluated using SEM.…”

Section: Evaluation Of Whisker Growthmentioning

confidence: 99%

The effect of electroplating parameters and substrate material on tin whisker formation

Ashworth

Wilcox

Higginson

et al. 2015

Microelectronics Reliability

View full text Add to dashboard Cite

a b s t r a c tElectroplated tin finishes are widely used in the electronics industry due to their excellent solderability, electrical conductivity and corrosion resistance. However, the spontaneous growth of tin whiskers during service can result in localised electrical shorting or other harmful effects. Until recently, the growth of tin whiskers was successfully mitigated by alloying the tin with lead. However, restriction in the use of lead in electronics as a result of EU legislation (RoHS) has led to renewed interest in finding a successful alternative mitigation strategy.Whisker formation has been investigated for a bright tin electrodeposit to determine whether whisker growth can, at least partially, be mitigated by control of electroplating parameters such as deposition current density and deposit thickness. The influence of substrate material and storage at 55°C/85% humidity on whisker growth have also been investigated.Whisker growth studies indicate that deposition parameters have a significant effect on both whisker density and whisker morphology. As deposition current density is increased there is a reduction in whisker density and a transition towards the formation of large eruptions rather than potentially more harmful filament whiskers. Increasing the tin coating thickness also results in a reduction in whisker density. Results demonstrate that whisker growth is most prolific from tin deposits on brass, whilst that from tin deposits on rolled silver is greater than that observed for tin deposits on copper.

show abstract