Corrosion behavior of hybrid coatings: Electroless Ni–Cu–P and sputtered TiN

Preparation of the electroless Ni–P and Ni–Cu–P coatings on engine cylinder and their tribological behaviors under bio-oil lubricated conditions

“…It can be seen that the wear loss of the cylinder had decreased by more than 90% after being coated, and Ni-Cu-P coating had better anti-wear effect than Ni-P coating. It is explained by the fact that the coatings could effectively prevent surfaces from corrosiveness of bio-oil, and without the protection of the coatings, the wear rate of the original cylinder would be accelerated by the corrosiveness of bio-oil [15]. In addition, with sliding speed increasing from 0.5 m/s (Fig.…”

“…Many multi-composite Ni-P coatings were prepared, including Ni-Cu-P [8], Ni-W-P [9], Ni-P-SiC [10], Ni-P-Al 2 O 3 [11], and Ni-P-B 4 C [12]. Due to the fact that copper can effectively reduce the boundary stress between matrix and surface coating, Ni-Cu-P coating shows very potential advantages in the field of anti-wear and anti-corrosion [8,[13][14][15].…”

Effect of copper content on the properties of electroless Ni–Cu–P coatings prepared on magnesium alloys

“…According to the available literature, electroless Ni-Cu-P deposits have been prepared almost on steel substrates [6,8,10], Al samples [11,12] and Cu sheets [13], but there is rare such report on magnesium alloys. The deposition of electroless Ni-Cu-P on magnesium alloys still encounters some difficulties.…”

Artificial neural networks implementation in Ni-Cu-P ternary coating: Investigation of the effects of bath stabilizers

“…The bath composition of the Ni-Cu-P plating were based on the solution, in which Nickel sulphate was used as source of nickel, and sodium hypophosphite was used as reducing agent [16]. Sodium acetate and sodium citrate was added as complexing agent.…”

“…For example, the coatings need to be more thermal stable when they were employed as the corrosion resistant coatings in flue gas condenser [3]. Recently, it is found that codeposition of copper in the Ni-P deposit to form an ternary Ni-Cu-P coating improves the thermal stability, corrosion resistance, solderability and thermal conductivity of the coatings [4][5][6]. However, the plating parameters of the Ni-Cu-P coating have not been studied thoroughly as that of the Ni-P coating [6][7][8].…”