Corrosion behavior of Cu and the Cu–Zn–Al shape memory alloy in simulated uterine fluid

Chen, Bangyi; Liang, Chenghao; Fu, Daojun; Ren, Deming

doi:10.1016/j.contraception.2005.04.006

Cited by 31 publications

(14 citation statements)

References 9 publications

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“…The current trend in implant science is the substitution of high-cost alloys by cheaper ones coated with protective and very stable biocompatible thin films [1][2][3][4][5][6]. The basic requirements for these films include: (i) adequate hardness and mechanical properties; (ii) considerable corrosion resistance in the oral environment and a high bonding strength with the base material [7,8].…”

Section: Introductionmentioning

confidence: 99%

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Electrochemical investigation of the passive behaviour of biomaterials based on Ag–Sn and Cu–Zn–Al in carbonate buffer in the absence and presence of chloride

et al. 2007

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The electrochemical behaviour of biomaterials based on Cu-Zn-Al (cubic Cu 3 Zn phase) and Ag-Sn (orthorhombic Ag 3 Sn and hexagonal Ag 4 Sn phases) alloys was investigated in carbonate buffer solutions (pH 9.66) in the absence and presence of chloride, using different electrochemical techniques. Analyses of the open circuit potential and the potentiodynamic polarisation curves showed that the passivation domain and the corrosion parameters depend on alloy composition and chloride concentration. Chronoamperometric studies showed that passivation kinetics and corrosion of the passive film are both well described by a linear ln(i) versus ln(t) relation. The passive film formed on the Ag-Sn alloy is less susceptible to corrosion when compared to the Cu-Zn-Al system. The impedance data obtained in the passive region for the Cu-Zn-Al alloy showed that the passive layer is compact. In contrast, the impedance data obtained for the Ag-Sn alloy showed that the passive layer is formed by a compact oxide layer covered by a porous oxide gel layer.Mott-Schottky analysis showed that the passive film formed on the Cu-Zn-Al alloy behaves as a p-type semiconductor.

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Section: Introductionmentioning

confidence: 99%

“…Corrosion of alloys in the oral environment finds its origin in the presence of several species, such as Cl -, the hydrogen ion (H + ), sulphide compounds (S 2-), dissolved oxygen (O 2 ), and micro organisms [1][2][3][4][5][6][7][8][9]. For instance, chloride causes pitting corrosion, which destroys the protective passive oxide film.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical investigation of the passive behaviour of biomaterials based on Ag–Sn and Cu–Zn–Al in carbonate buffer in the absence and presence of chloride

et al. 2007

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“…Its industrial and technical uses include marine fittings and plumbing fixtures because of its corrosion resistance. Also, it is used in the manufacture of heating coils [7].The electrochemical behavior of binary Cu-Ni and Cu-Zn alloys in chloride free and chloride containing solutions has been investigated extensively [8][9][10][11][12][13].The systematic investigation of the electrochemical behavior of Cu-ternary alloys like Cu-Ni-Zn compared to Cu has attracted little attention. In our previous publications we compared the polarization behavior of some Cu-ternary alloys in neutral chloride and chloride solution polluted by sulfide ions [14,15].…”

Section: Introductionmentioning

confidence: 99%

Comparison of Electrochemical Behavior of Cu-10Ni-10Zn Alloy and Cu in Aqueous Solutions

Badawy

El-Rabiei

Nady

et al. 2015

Zeitschrift Für Physikalische Chemie

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The electrochemical behavior of Cu-10Ni-10Zn alloy and Cu was investigated in acidic, neutral and basic solutions. The effect of chloride ions in neutral solutions was also studied. Conventional electrochemical techniques and electrochemical impedance spectroscopy were used. The corrosion rate of these materials in acidic solutions is relatively high compared to that in neutral or basic solutions. The open-circuit potential of the alloy is nearly the same as that of pure copper in the different media, indicating that the processes which occur on the alloy surface are mainly governed by copper dissolution. In chloride solutions the rate of Cu corrosion is remarkably high. In the alloy, the copper dissolution was suppressed by the presence of nickel and zinc, due to the formation of complex oxide layers. The impedance data were fitted to equivalent circuit models that explain the different electrochemical processes occurring at the electrode/electrolyte interface. SEM and EDAX have shown that the alloy surface is enriched with Ni. In neutral solutions the chloride ions are penetrating the metallic surface.

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“…. In the Zn-containing alloys, an additional passivation process is taking place due to the formation of Znoxide film during a dezincification process according to [34]:…”

Section: Potentiodynamic Polarization Curvesmentioning

confidence: 99%

Electrochemical Stability of Cu–10Al–10Zn, Cu–10Al–10Ni, and Cu–10Ni–10Zn Ternary Alloys in Simulated Physiological Solutions

Nady

El-Rabiei

2016

J Bio Tribo Corros

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Copper-based alloys are widely used in the consumer electronics industry for components such as connector contacts, shielding gaskets, and terminals. Nickel silver is a general term for alloys that contain copper, nickel, and zinc. Nickel silver first became popular as a base metal for silver-plated cutlery and other silverware, notably electro-plated nickel silver, jewelery and coins. In this article, the electrochemical stability of Cu10Ni-10Zn alloy was compared with that of pure copper and two of copper ternary alloys, namely Cu-10Al-10Zn and Cu-10Al-10Ni in synthetic sweat solution, Hank's solution and in Ringer physiological solution. Corrosion behavior of the different electrodes was investigated using cyclic voltammetry, potentiodynamic polarization, and impedance spectroscopy techniques. The CVs showed peaks concerning the redox reactions for copper. These peaks were assigned to the formation and reduction of copper species. Furthermore, they showed that the copper oxidation was suppressed to a large extent by the presence of Ni and zinc in the alloy composition than the presence of Al and Zn or the presence of Al and Ni elements. Also, the results showed that the Cu-10Ni-10Zn alloy exhibited good corrosion resistance due to the formation of a protective passive film. The electrochemical impedance spectroscopy results indicated that either a duplex film with an inner barrier layer and an outer porous layer or a single passive layer was formed on the surface. The formation of such passive film was discussed, and the different alloy surfaces examined by scanning electron microscopy and subjected to EDAX analysis. The surface analysis has shown the participation of the different alloying elements in the passive film according to the alloy constituents.Graphical Abstract Addition of Ni decreases the rate of corrosion of the Cu, and the Cu-10Ni-10Zn was found to be the most corrosion-resistant alloy.

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Corrosion behavior of Cu and the Cu–Zn–Al shape memory alloy in simulated uterine fluid

Cited by 31 publications

References 9 publications

Electrochemical investigation of the passive behaviour of biomaterials based on Ag–Sn and Cu–Zn–Al in carbonate buffer in the absence and presence of chloride

Electrochemical investigation of the passive behaviour of biomaterials based on Ag–Sn and Cu–Zn–Al in carbonate buffer in the absence and presence of chloride

Comparison of Electrochemical Behavior of Cu-10Ni-10Zn Alloy and Cu in Aqueous Solutions

Electrochemical Stability of Cu–10Al–10Zn, Cu–10Al–10Ni, and Cu–10Ni–10Zn Ternary Alloys in Simulated Physiological Solutions

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