Correlation of Intrinsic Thin Film Stress Evolution and IMC Growth with Whisker Growth

Rodekohr, C.L.; Flowers, George T.; Bozack, Michael J.; Jackson, Robert L.; Martens, Rod; Zhao, Zhi-Tao; Crandall, Erika R.; Štarman, Václav; Bitner, T.; Street, John N.

doi:10.1109/holm.2011.6034804

Cited by 6 publications

(2 citation statements)

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“…Also, we did not observe any features between the layers that can be identified as intermetallic compounds (IMCs) [4,14,22]. The formation of IMCs is often considered solely responsible for, or at least contributing to, the whiskers growth although there are contradicting observations [37][38][39]. EDS analysis was performed to confirm the chemical composition of the deposited films.…”

Section: Resultsmentioning

confidence: 84%

Sn whisker growth mitigation by using NiO sublayers

Borra

Itapu

Georgiev

2017

J. Phys. D: Appl. Phys.

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The potential of NiO sublayers for whisker growth mitigation has been examined. A thin NiO film was applied on a Cu-coated substrate before the deposition of a thicker Sn layer. The growth of Sn whiskers was then followed by optical and scanning electron microscopy and was compared with the whisker growth on a control sample without the NiO sublayer. No whiskers were observed on the sample with the NiO layer even after 12 months, whereas the control sample developed whiskers of size and density that is generally expected, based on the vast amount of published work on the topic. The mechanisms of whisker growth and whisker growth suppression are briefly discussed as well.

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