Correlation considerations: Real HBM to TLP and HBM testers

Barth, Jon; Richner, John

doi:10.1016/s0026-2714(02)00054-9

Cited by 13 publications

(3 citation statements)

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“…Despite stringent requirements for parallelism, achieving perfectly uniform load application remains challenging. To accurately capture the strain experienced by the specimen, we utilized biaxial strain gauges of type HBK 1-XY1x-1.5/120 [23] attached to two opposite faces of the cube. These gauges were specifically chosen for their ability to measure the strain both parallel and perpendicular to the direction of the applied load on the respective surfaces.…”

Section: Experimental Set-upmentioning

confidence: 99%

Experimental Comparative Analysis of the Through-Thickness and In-Plane Compression Moduli of Unidirectional CFRP Laminates

Bogenfeld

2024

J. Compos. Sci.

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This study explores the experimental characterization of the through-thickness compression properties in unidirectional laminates using cube compression tests. Cubical specimens, each with an edge length of 10, were symmetrically outfitted with biaxial strain gauges and subjected to a compression test. While similar methodologies exist in the literature, this work primarily addresses the potential biases inherent in the testing procedure and their mitigation. The influence of friction-induced non-uniform deformation behavior is compensated through a scaling of the stiffness measurements using finite element (FE) analysis results. This scaling significantly enhances the accuracy of the resulting parameters of the experiments. The ultimate failure of the specimens, originating from stress concentrations at the edges, resulted in fracture angles ranging between 60∘ and 67∘. Such fracture patterns, consistent with findings from other researchers, are attributed to shear stress induced by friction at the load introduction faces. The key findings of this research are the comparisons between the through-thickness modulus (E33c) and strength (X33c) and their in-plane counterparts (E22c and X22c). The results indicate deteriorations of E33c and X33c from E22c and X22c by margins of 5 and 7, respectively. Furthermore, the results for E22c and X22c were compared with the results obtained through a standard test, revealing a 12 enhancement in strength X22c and 4 underestimated stiffness E22c in the cube compression test.

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Section: Experimental Set-upmentioning

confidence: 99%

Experimental Comparative Analysis of the Through-Thickness and In-Plane Compression Moduli of Unidirectional CFRP Laminates

Bogenfeld

2024

J. Compos. Sci.

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“…Transmission line pulse (TLP) testing has seen considerable growth in the ESD discipline [83][84][85][86][87]. In this form of ESD testing, a transmission line cable is charged using a voltage source.…”

Section: Transmission Line Pulse (Tlp) Model Characteristic Timementioning

confidence: 99%

Electrostatic Discharge

2005

Esd

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Apre for publi relese; 4. PERFORMING ORGANIZATION REPORT NUMBERIS) 5. MONITORING ORGANIZATION REPORT NUMBER(SI 87-0670 G&. NAME OF PERFORMING ORGANIZATION ~b. OFFICE SYMBOL 7a NAME OF MONITORING ORGANIZATION (it applica ble) ACSC/EDCCI 6c. ADDRESS fCaty. State and ZIP Code) 7b. ADDRESS (City. State and ZIP Cod*) MAXWELL AF8, AL 36112-5542 ft. NAME Of FUNOINO/SPONSORING Off. OFFICE SYMBOL g. PROCUREMENT INSTRUMENT IDENTIFICATION NUMBER ORGANIZATION J Iapplicable) Sc, ADDRESS (CUy. State and ZIP Code) 10. SOURCE OF FUNDING NOS CPROGRAM PROJECT TASK WORK UNIT E LE MENT NO. NO. No. NO -~ 11 TITLE finc Jude Security Ckitseficationj ELECTROSTATIC DISCHARGE______ 12. PERSONAL AUTHOR(S) DIEHL, JAMES F. CAPTAIN,* USAF 13& TYPE OF REPOR 13b. TIME COVERED 14 DATE OF REPORT (Yr., Mo.. Dayj 15. PAGE COUNT FROM ___ TO ____ 1987 APRIL 55 V 16. SUPPLEMENTARY NOTATION 17 COSATI CODES 18 SUBJECT TERMS (Continue on reverse if necessary an~d identify by block number)1F IELD GROUP SUB GR It.S ATA CT lCum In wne on rom,.re IfI necir..rv an d identHfy 6 y block nu mborI "~Advances in microtechnology have resulted in electrical components with numerous advantages, including increased capability, reduced weight and size, and low operating power requirements. Unfortunately, these new microtechnology components are extremely sensitive to the damaging effects of electrostatic discharge (ESD).This study describes, in laymen's terms, ESD and the need for effective ESD controls.Emphasis is placed on ESD controls in the Air Force.This study conclude-. 6y recoinmending the establishment of a comprehensive Air Force ESD control program.

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“…In order to interpret the result of VFTLP test in terms of CDM qualification, the correlation between the passing levels of CDM and VFTLP is indispensible. The correlation between qualification test and TLP test has been demonstrated between HBM and TLP [1][2][3][4][5], and between HMM and TLP [6]. However, the difference between CDM and VFTLP tests is significant, which makes the correlation between them more challenging to find than that of HBM and TLP.…”

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confidence: 99%

Correlation of very fast transmission line pulse (VFTLP) and Field-Induced Charged Device Model (CDM) Testing

Xue

2012

2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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The correlation between the second break down current of VFTLP Testing and the passing voltage of Field-Induced CDM Testing has been derived. The derivation is based on the power to failure relation and RLC model of CDM test. The derived correlation has been also demonstrated in experiment. I. BACKGROUNDField-Induced Charged Device Model (CDM) has been widely applied for the CDM qualification test in the industry. However, the CDM test is unable to characterize the operational response of ESD protection devices. The need for device characterization is well met by Very Fast Transmission Line Pulse (VFTLP) test instead. In order to interpret the result of VFTLP test in terms of CDM qualification, the correlation between the passing levels of CDM and VFTLP is indispensible. The correlation between qualification test and TLP test has been demonstrated between HBM and TLP [1][2][3][4][5], and between HMM and TLP [6]. However, the difference between CDM and VFTLP tests is significant, which makes the correlation between them more challenging to find than that of HBM and TLP. II. CDM MODELINGAtwood et al. [2] proposed a three capacitor model for CDM tester. This model has been applied in the simulation of CDM test and sees good approximation [7]. The schematic of the model is shown in Figure 1. C_DUT denotes the capacitance between the Device Under Test (DUT) with the field plate of the CDM tester; C_DG denotes the capacitance between DUT and the ground plate; and C_FG denotes the capacitance between the ground plate and the field plate. Switch S1 represents the pogo pin connecting ground plate and DUT; L1 and R2 represent the parasitic inductance and resistance in the discharging path. During the charging phase of CDM test, S1 remains open and the three capacitors namely C_DUT, C_DG, and C_FG are charged up between high voltage V_CDM and Ground. When discharge occurs, the S1 closes forming a low impedance path to Ground and the capacitors are discharged. Fig. 1. Three Capacitor ModelThe RLC circuit is solved as follows:The current in discharging pass isis therefore,· 1 ( ) 2 C_DUT S1 V_CDM R1 100e6 L1 C_FG C_DG R2

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Correlation considerations: Real HBM to TLP and HBM testers

Cited by 13 publications

References 1 publication

Experimental Comparative Analysis of the Through-Thickness and In-Plane Compression Moduli of Unidirectional CFRP Laminates

Experimental Comparative Analysis of the Through-Thickness and In-Plane Compression Moduli of Unidirectional CFRP Laminates

Electrostatic Discharge

Correlation of very fast transmission line pulse (VFTLP) and Field-Induced Charged Device Model (CDM) Testing

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