Copper–Nickel Alloy Plating to Improve the Contact Resistivity of Metal Grid on Silicon Heterojunction Solar Cells

Lee, Sangeun; Lee, Doo Won; Lim, Kyoung‐jin; Shin, Won-Suk; Kim, Jeong

doi:10.1007/s13391-019-00134-x

Cited by 24 publications

(5 citation statements)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, to develop the industrial applications of these coatings, further improvement in their final properties including corrosion resistance is of crucial importance. Hence, it seems that these coatings may satisfactorily meet the demands of hard coatings with suitable anticorrosive coatings [1][2][3][4][5][6][7]. Thanks to aforementioned features, these coatings are extensively used in mining, metallurgical industry, sea water applications (e.g.…”

Section: Introductionmentioning

confidence: 99%

Perspectives in corrosion-performance of Ni–Cu coatings by adding Y₂O₃ nanoparticles

Safavi

Fathi

Mirzazadeh

et al. 2020

Surface Engineering

View full text Add to dashboard Cite

Ni-Cu alloy coatings are well-known for their favourable corrosion resistance. However, further improvement in their corrosion resistance through incorporation of reinforcing agents can open new windows of industrial applications. The main focus of this paper is on evaluating the effects of Y 2 O 3 nanoparticles inclusion on the corrosion performance of electrodeposited Ni-Cu alloy coatings. Electrochemical impedance spectroscopy (EIS), Tafel polarization, and open circuit potential (OCP) measurements were used to assess the corrosion performance of the coatings. According to the results, there is no obvious change in the phase structure of the coatings. Moreover, the surface morphology of Ni-Cu alloy coatings change from cauliflowerlike to featureless with introduction of Y 2 O 3 nanoparticles. Mapping analysis confirms the uniform dispersion of the embedded nanoparticles throughout the matrix. Ni-Cu-4 g L −1 Y 2 O 3 nanocomposite coating exhibits the most favourable corrosion performance mainly due to possessing the highest Y 2 O 3 content along with minimum microstructural defects including pores, voids and micro-cracks.

show abstract

Section: Introductionmentioning

confidence: 99%

Perspectives in corrosion-performance of Ni–Cu coatings by adding Y₂O₃ nanoparticles

Safavi

Fathi

Mirzazadeh

et al. 2020

Surface Engineering

View full text Add to dashboard Cite

show abstract

“…Assuming the Fe/Ni and Ni/Cu interfaces have much lower contact resistivities and the bulk resistances are negligible, the determined contact resistivities should mostly apply to the Fe/ITO interface. The lowest contact resistivities of electroplated metal contacts on ITO reported previously by Lee et al 8 48 Ω/□) for Au/ITO and even lower values for Ni/ITO. After normalization of the contact resistance, the contact resistivity is calculated with Eq.…”

Section: Discussionmentioning

confidence: 63%

“…Recently, electroplating of intermediate transition metal layers before the Cu electroplating were studied. Lee et al 8 used an electroplated Cu-Ni alloy seed layer. Minsek 9 invented a process where the electroplating of zinc, zinc oxide and zinc alloys leads to adherent films on TCOs.…”

mentioning

confidence: 99%

Direct Electroplating on Indium-Tin-Oxide-Coated Textured and Polished Silicon Substrates via Transition Metal Alloyed Interlayers

Politze¹,

Scholz²,

Windgassen³

et al. 2022

J. Electrochem. Soc.

View full text Add to dashboard Cite

Fe electroplating was used on polished or pyramidally textured indium-tin-oxide (ITO)-coated silicon substrates as an initial layer for subsequent Ni and Cu plating. Up to 15 μm thick Cu layers were deposited on the Ni/Fe intermediate layer. The adhesion strength of this metal layer stack was qualitatively shown using the scotch tape method and quantified by measuring the pull-off stress of the metal stack on ITO. 1.44 and 1.28 MPa was applied to pull off the metal stack from polished and pyramidally textured substrates, respectively. Electrical contact properties were measured by circular transmission line model structures. Very low contact resistivity for electroplated metal on ITO of 6.5E−7 and 9.0E−7 Ωcm2 with transfer lengths of 487 and 720nm are determined for polished and pyramidally textured substrates, respectively.

show abstract

“…The I‐V curves are measured over a pair of electrodes with different spacings. By fitting R T as a function of the electrode stripe interval ( D ), the transfer length ( L T ) can be obtained by extrapolating the fitting curve to the x ‐axis, where the intercept is ‐2 L T , 81 and the y ‐intercept of the curve equals to 2 R c . The value of R c can be described by 75 :

R_{normalc} = \frac{ρ_{c}}{L_{normalT} Z} \coth (\frac{L}{L_{normalT}})

where Z and L are the length and width of metal stripes, respectively.…”

Section: Dopant‐free Passivating Contacts: Mechanism Characterization...mentioning

confidence: 99%

Dopant‐free passivating contacts for crystalline silicon solar cells: Progress and prospects

Wang

Zhang

et al. 2022

EcoMat

View full text Add to dashboard Cite

The evolution of the contact scheme has driven the technology revolution of crystalline silicon (c-Si) solar cells. The state-of-the-art high-efficiency c-Si solar cells such as silicon heterojunction (SHJ) and tunnel oxide passivated contact (TOPCon) solar cells are featured with passivating contacts based on doped Si thin films, which induce parasitic optical absorption loss and require capitalintensive deposition processes involving flammable and toxic gasses. A promising solution to tackle this problem is to employ dopant-free passivating contact, involving the use of transparent and cost-effective wide band gap materials. In this review, we first introduce the dopant-free passivating contact, from carrier transport mechanisms, material classification to evaluation methods. Then we focus on the advances in different strategies to improve cell performance, including material property optimization, structural and interfacial engineering, as well as various post-treatments. At the end, the challenge and perspective of dopant-free passivating contact c-Si solar cells are discussed.

show abstract

Copper–Nickel Alloy Plating to Improve the Contact Resistivity of Metal Grid on Silicon Heterojunction Solar Cells

Cited by 24 publications

References 28 publications

Perspectives in corrosion-performance of Ni–Cu coatings by adding Y₂O₃ nanoparticles

Perspectives in corrosion-performance of Ni–Cu coatings by adding Y₂O₃ nanoparticles

Direct Electroplating on Indium-Tin-Oxide-Coated Textured and Polished Silicon Substrates via Transition Metal Alloyed Interlayers

Dopant‐free passivating contacts for crystalline silicon solar cells: Progress and prospects

Contact Info

Product

Resources

About

Copper–Nickel Alloy Plating to Improve the Contact Resistivity of Metal Grid on Silicon Heterojunction Solar Cells

Cited by 24 publications

References 28 publications

Perspectives in corrosion-performance of Ni–Cu coatings by adding Y2O3 nanoparticles

Perspectives in corrosion-performance of Ni–Cu coatings by adding Y2O3 nanoparticles

Direct Electroplating on Indium-Tin-Oxide-Coated Textured and Polished Silicon Substrates via Transition Metal Alloyed Interlayers

Dopant‐free passivating contacts for crystalline silicon solar cells: Progress and prospects

Contact Info

Product

Resources

About

Perspectives in corrosion-performance of Ni–Cu coatings by adding Y₂O₃ nanoparticles

Perspectives in corrosion-performance of Ni–Cu coatings by adding Y₂O₃ nanoparticles