Coplanar 122-GHz Antenna Array With Air Cavity Reflector for Integration in Plastic Packages

Beer, Stefan; Gulan, Heiko; Rusch, Christian; Zwick, Thomas

doi:10.1109/lawp.2012.2186783

Cited by 48 publications

(19 citation statements)

References 11 publications

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“…The OCA is measured in the receiving mode by receiving radiation from the transmitting W-band calibrated horn antenna which is fed by a frequency multiplier. The antenna gain is calculated as (2) in which all the terms given are in dB scale: and are the power received at the spectrum analyzer when using the antenna under test (AUT) and an additional calibrated horn as receiving antennas, respectively, with gain (24 dBi at 94 GHz). Furthermore, is the total insertion loss including that from the probe (1 dB), the balun (1.5 dB), the 2.5-mm-long microstrip feed line (3 dB) and an estimated transition loss between probe tip and the on-chip CPW (0.5 dB), with a total loss of 6 dB.…”

Section: B Antenna Gain and Radiation Patternmentioning

confidence: 99%

“…Antennas designed on package substrates usually show good radiation performance in terms of radiation efficiency and gain. In [2], an 11.5-dBi broadside gain was achieved from a 2 2 small patch array utilizing wirebond as the interconnection between the die and the feed line of the off-chip antenna. Although chip-to-chip interconnections (e.g., wirebond) show low insertion loss at mm-wave frequencies below 100 GHz their performance still suffers from fabrication tolerance including misalignment and deviations from desired length and shapes [3], which could be a detrimental factor at sub-mm-wave frequencies.…”

Section: Introductionmentioning

confidence: 99%

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A 94-GHz Extremely Thin Metasurface-Based BiCMOS On-Chip Antenna

Pan

Caster

Heydari

et al. 2014

IEEE Trans. Antennas Propagat.

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Abstract-A novel fully on-chip antenna based on a metasurface fabricated in a 180-nm BiCMOS process is presented. Inspired by the concept of high impedance surface (HIS), this metasurface is not used as a reflector below an antenna as commonly done. Instead, it is used as a radiator by itself. The extremely thin metasurface is composed of a patterned top two metal layers and the ground plane placed in the lowest metal layer in the process. The ground plane on the lowest metal layer of the process provides a solid shielding from the substrate and other possible circuitries. The fundamental of the antenna radiation and design are described. The measured antenna shows 2.5 dBi peak broadside gain with 8-GHz 3-dB gain bandwidth and an impedance bandwidth larger than 10 GHz. In its class of broadside radiating fully on-chip antennas, with a ground plane on the lower metal layer of the process, and without additional fabrication processing, this structure achieves the widest impedance bandwidth at W-band and one of the highest gain and gain bandwidth. It is noteworthy that this is achieved with an extremely thin antenna substrate thickness and a shielding ground plane.Index Terms-Artificial magnetic conductor, high-impedance surface, leaky wave antenna, Marchand balun, millimeter wave, millimeter wave antennas, on-chip antenna.

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Section: B Antenna Gain and Radiation Patternmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A 94-GHz Extremely Thin Metasurface-Based BiCMOS On-Chip Antenna

Pan

Caster

Heydari

et al. 2014

IEEE Trans. Antennas Propagat.

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“…The idea of the EU funded project SUCCESS [20] is the realization of a complete RF radar frontend on a single chip combined with high efficient off-chip antennas [13], [14], [15] since the directivity and efficiency of on-chip antennas is in general limited due to the high permittivity semiconductor substrates [9]. A low-cost packaging solution is aspired by using standard QFN packages [16], [17], [18], [19] for the complete System in Package approach in which no RF signals have to be routed through the lead frame of the package.…”

Section: Introductionmentioning

confidence: 99%

Miniaturized 122 GHz short range radar sensor with antenna-in-package (AiP) and dielectric lens

Göttel

Pauli

Gulan

et al. 2014

The 8th European Conference on Antennas and Propagation (EuCAP 2014)

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This paper shows a SiGe single chip radar sensor with high efficient LCP off-chip antennas integrated in a standard QFN package at a center frequency of 122.5 GHz. The millimeterwave interconnect is performed by a CPW bond-wire connection with subsequent matching network. For demonstration purposes a complete baseband processing and RF unit is implemented on a PCB and integrated in a plastic housing where a focusing HDPE lens with a directivity of 30.7 dBi for gain enhancement can be connected. Distance measurements in a real world scenario are performed from 0.4 -18.25 m and 0.6 -14.5 m for a metal plate and a wooden plate, respectively. Additionally, a velocity measurement from 0.5 -5 m/s in the laboratory is performed.

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“…References [1] and [2] provide an elaborate review of OCAs, especially on silicon substrate at mm-waves. Despite lower gain and efficiency compared to off-chip counterparts, such as antennas in a package [3], which have been developed for 60-GHz applications [2], [4], OCAs offer the least feedline interconnection losses, which is a substantial advantage for submillimeter-wave systems. However, designing a high-gain and high-efficiency OCA is very challenging for various reasons.…”

mentioning

confidence: 99%