Cooling strategies for embedded electronic components of wearable computers fabricated by shape deposition manufacturing

Egan, E.; Amón, Cristina H.

doi:10.1109/itherm.1996.534540

Cited by 5 publications

(3 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The inclusion of wearable computing is what makes an E-textile a smart textile. The 1990s and early 2000s saw patents for devices either integrated onto the surface of garments or contained within pockets beginning to emerge [36][37][38][39][40][41][42]. These are generally regarded as the first generation E-textiles, where an electrical circuit or electronic components were attached to a garment.…”

Section: Materials Developments and Wearable Computingmentioning

confidence: 99%

A Historical Review of the Development of Electronic Textiles

Hughes‐Riley

Dias

Cork

2018

Fibers

116

View full text Add to dashboard Cite

Abstract:Textiles have been at the heart of human technological progress for thousands of years, with textile developments closely tied to key inventions that have shaped societies. The relatively recent invention of electronic textiles is set to push boundaries again and has already opened up the potential for garments relevant to defense, sports, medicine, and health monitoring. The aim of this review is to provide an overview of the key innovative pathways in the development of electronic textiles to date using sources available in the public domain regarding electronic textiles (E-textiles); this includes academic literature, commercialized products, and published patents. The literature shows that electronics can be integrated into textiles, where integration is achieved by either attaching the electronics onto the surface of a textile, electronics are added at the textile manufacturing stage, or electronics are incorporated at the yarn stage. Methods of integration can have an influence on the textiles properties such as the drapability of the textile.

show abstract

Section: Materials Developments and Wearable Computingmentioning

confidence: 99%

A Historical Review of the Development of Electronic Textiles

Hughes‐Riley

Dias

Cork

2018

Fibers

116

View full text Add to dashboard Cite

show abstract

“…The modern designer should consider the many choices available in the selection of the appropriate devices used in the thermal design [6]. In most desk-top computer designs, forced air cooling has been employed [3], however, the unique constraints of wearable computers renders air ventilation slots on the outercase unfeasible and the use of fans impractical.…”

mentioning

confidence: 99%

Thermal management and concurrent system design of a wearable multicomputer

Amón

Egan

Smailagic

et al. 1997

IEEE Trans. Comp., Packag., Manufact. Technol. A

Self Cite

View full text Add to dashboard Cite

This paper describes the concurrent system design and thermal management of the Navigator2 which is used as a computerized maintenance manual for aircraft inspection with speech recognition capabilities. The Navigator2 is a wearable computer that includes a novel dual architecture, spread spectrum radio, and variable gain amplifier (VGA) head-mounted display. The semi-custom electronic design includes two electronic boards-a custom-designed system board and a 486-based processor board. The system board captures glue logic functions and provides support for two PCMCIA slots, a power management microcontroller, memory backup batteries, and a power supply. The thermal design of the Navigator2 develops concurrently with the overall design in a series of stages. A framework of concurrent thermal engineering consisting of three basic stages is used to maintain interdisciplinary interaction while satisfying thermal design goals. In the first stage of the thermal design, a cooling arrangement that meets the needs of other disciplines is proposed, and an enhanced-conduction thermal design with aluminum heat spreaders and active power-saving is explored. In the second stage, the thermal contact between heat spreaders and electronic components is optimized, and physical experimentation is performed with liquid heat sinks and conductive elastomers as thermal contact interfaces. In the third stage, numerical simulations are performed to ascertain the effectiveness of the thermal design, giving the thermal designer flexibility to change critical parameters and perform sensitivity analyses. A simplified computational model is used to investigate the performance of thermal interface devices and the effect of the heat spreader design on the maximum electronic component temperatures. Although the simplified model proves adequate for thermal design purposes, a detailed geometrically-accurate computational model assesses the adequacy of the exposed heat spreader surface area and predicts temperature distributions with better agreement to the experimental measurements on the Navigator2.

show abstract

“…Figure 1 displays the TIA (Technical Information Assistant) wearable computer, an example of a challenging practical problem in thermal management, where natural convection is the means of heat dissipation. For this wearable computer, placing a heat spreader on a heat-producing component to allow the heat to be dissipated to the ambient as suggested by Egan and Amon [2] yields a high surface temperature, which could exceed maximum ergonomic requirements. Active thermal management may prevent an electronic overheating but a cyclic burst of power generation increases the probability of failure due to thermal fatigue induced by cyclic heating and cooling of an electronic device.…”

Section: Introductionmentioning

confidence: 99%

Performance analysis of an enhanced PCM thermal control unit

Alawadhi

Amón²

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH3

Self Cite

View full text Add to dashboard Cite

This paper reports the investigation of a Thermal Control Unit (TCU) implemented into an electronic device to improve energy management, absorb excessive heat generated by the heat source component in a quick manner and maintain surface temperature below critical limits. The TCU is made of an organic Phase Change Material (PCM) and a Thermal Conductivity Enhancer (TCE), composed of aluminum fins. The effect of the fin distribution on the performance of the TCU is investigated over a range of operation conditions. To quantify the improvements of the TCU with the TCE, it is compared with the baseline case of TCU without TCE. Results illustrate significant effects of the TCE for both constant and variable power operations. In a constant power operation, the TCE helps to keep the TCU temperature uniform and constant during PCM melting, in which overheating of the PCM is prevented. During variable power operations, the TCE helps to reduce fluctuating temperatures in the TCU, with a reduction in maximum temperature of IO "C. 0-7803-591 2-7/00/$10.0002000 IEEE

show abstract

Cooling strategies for embedded electronic components of wearable computers fabricated by shape deposition manufacturing

Cited by 5 publications

References 8 publications

A Historical Review of the Development of Electronic Textiles

A Historical Review of the Development of Electronic Textiles

Thermal management and concurrent system design of a wearable multicomputer

Performance analysis of an enhanced PCM thermal control unit

Contact Info

Product

Resources

About