Cooling of minimized surface-mount packages in power electronics applications

Sir, Michal

doi:10.15199/48.2020.11.31

Cited by 2 publications

(2 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…To use the best available technology to resolve the cooling challenge and gain the maximum performance of semiconductors, the dual-layer insulated metal substrate (IMS) board is used where the substrate is made of copper base material. The stack-up of IMS board contains optimized thermal vias bridging the middle layer [9], to improve overall thermal performance. Single sided SMT board is subsequently adhesively coupled with thermal conductive interface to an aluminium heatsink.…”

Section: Hardware Descriptionmentioning

confidence: 99%

Efficiency optimization of totem pole PFC with Gallium Nitride semiconductors

Sir¹

2021

ELECTROTECHNICAL REVIEW

Self Cite

View full text Add to dashboard Cite

Novel Gallium Nitride wide bandgap semiconductor devices are capable of improving efficiency of power converters. This article presents a practical optimisation of GaN converter application in the totem-pole power factor conversion converter. As the bottom side cooled devices are used, the article shows integration of switching device and gate driver on a single insulated metal substrate board, attractive for high power density power supply solutions. Measured efficiency data together with analysis of losses distribution and optimization at specific operating conditions are included. Design files of printed circuit board, created in free tool KiCad, used for evaluated prototype are part of this publication. Streszczenie. Nowatorskie urządzenia półprzewodnikowe z azotkiem galu o szerokiej przerwie energetycznej są w stanie poprawić wydajność przekształtników mocy. W artykule przedstawiono praktyczną optymalizację zastosowania konwerteraGaN w przekształtniku konwersji współczynnika mocy. Ponieważ stosowane są urządzenia chłodzone od spodu, artykuł przedstawia integrację urządzenia przełączającego i sterownika bramki na pojedynczej izolowanej płycie z metalowym podłożem, co jest atrakcyjne dla rozwiązań zasilających o dużej gęstości mocy. Uwzględniono dane dotyczące zmierzonej sprawności wraz z analizą rozkładu strat i optymalizacją w określonych warunkach pracy. (Optymalizacja wydajności przekształtnika PFC z półprzewodnikami z azotku galu)

show abstract

Section: Hardware Descriptionmentioning

confidence: 99%

Efficiency optimization of totem pole PFC with Gallium Nitride semiconductors

Sir¹

2021

ELECTROTECHNICAL REVIEW

Self Cite

View full text Add to dashboard Cite

show abstract

“…Several methods for cooling high-power surface mount technology (SMT) components are described in [16,17], as well as the impact of the vias placement on the cooling performance [18]. The first uses the thermal vias in the two-layer or multilayer PCB as shown in Figure 2a.…”

Section: Introductionmentioning

confidence: 99%

Compact 3 × 1 Matrix Converter Module Based on the SiC Devices with Easy Expandability

Resutik

Kascak

2021

Applied Sciences

View full text Add to dashboard Cite

This paper discusses a new approach for building a compact all-in-one matrix converter module based on SiC semiconductors arranged in a common source connection. The used transistors are in the D2PAK package. The design of the module is divided into two parts, namely a power module designed at one-layer aluminum substrate printed circuit board (PCB) to ensure good thermal performance and voltage isolation between the module and heatsink. The second board is responsible for the SiC driving and is mounted at the top of the power PCB and consists of metal-oxide semiconductor field effect transistor (MOSFET) drivers, isolated power supplies, a current direction detection circuit, and current value sensors. In the paper, the proper function of the SiC MOSFET drivers, current direction detection, and current measurement sensors were evaluated. Finally, 3D design together with the final prototype is presented. The modules contain three bidirectional cells for interconnection three input voltage sources and one output phase. The uniqueness and novelty of the presented module are the compactness and easy expandability of the module to achieve higher power outputs and multiphase applications such as five phase machines.

show abstract

Cooling of minimized surface-mount packages in power electronics applications

Cited by 2 publications

References 0 publications

Efficiency optimization of totem pole PFC with Gallium Nitride semiconductors

Efficiency optimization of totem pole PFC with Gallium Nitride semiconductors

Compact 3 × 1 Matrix Converter Module Based on the SiC Devices with Easy Expandability

Contact Info

Product

Resources

About