“…Epoxy resins, an important class of thermosetting polymers, are widely used as adhesives and composite materials in a variety of manufacturing industries ranging from aerospace and automotive engineering to microelectronics, thanks to their excellent mechanical strength, thermal stability, and chemical resistance. − Epoxy resins, generally obtained via the curing reaction of epoxy and hardener compounds, are amorphous and highly cross-linked networks with a glass transition temperature ( T g ) well above room temperature. , Thus, under ambient conditions, they are relatively brittle materials with a poor resistance to crack initiation and propagation . Over the past few decades, many attempts have been devoted to improving the fracture performance of epoxy materials by adding a second micro/nanophase of dispersed fillers into reaction mixtures prior to the network formation. − Various types of fillers ranging from soft rubbers to hard inorganic particles have been proven to substantially increase the fracture toughness of epoxy resins, although their effects on other thermomechanical properties can vary. − A comprehensive comparison of the effect of different filler types on the toughness and thermomechanical properties of epoxy resins has been reported by Kinloch and co-workers. − For example, they found that the addition of approximately 10% by mass of silica nanoparticles to an epoxy matrix can simultaneously increase the fracture energy by ∼250% and elastic modulus by ∼15%, while the sample T g remains almost unchanged. They also observed a similar magnitude in the fracture energy increase for this epoxy resin when filled with approximately 9% by mass of rubber particles, but the epoxy modulus and T g are decreased by ∼20% and ∼15 K, respectively. , Studies from other research groups have also evidenced such a positive effect of silica nanoparticles on multiple physical properties for different epoxy systems. ,,,, …”