2001
DOI: 10.1007/bf01183666
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Control of the transient thermoelastic displacement of a functionally graded rectangular plate bonded to a piezoelectric plate due to nonuniform heating

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Cited by 37 publications
(14 citation statements)
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“…Among those, Ootao and Tanigawa [20] theoretically investigated the simply supported functionally graded (FG) rectangular plate integrated with a piezoelectric plate subjected to transient thermal loading. A 3-D solution for rectangular FG plates coupled with a piezoelectric actuator layer was proposed by Reddy and Cheng [21] using transfer matrix and asymptotic expansion techniques.…”
Section: Introductionmentioning
confidence: 99%
“…Among those, Ootao and Tanigawa [20] theoretically investigated the simply supported functionally graded (FG) rectangular plate integrated with a piezoelectric plate subjected to transient thermal loading. A 3-D solution for rectangular FG plates coupled with a piezoelectric actuator layer was proposed by Reddy and Cheng [21] using transfer matrix and asymptotic expansion techniques.…”
Section: Introductionmentioning
confidence: 99%
“…Considerable interest has also been focused on investigating the performance of FG plates integrated with the piezoelectric actuators. For example, Ootao and Tanigawa [25,26] theoretically investigated the simply supported FG plate integrated with a piezoelectric plate subjected to transient thermal loading. Reddy and Cheng [27] presented a threedimensional solutions for FG plates coupled with piezoelectric actuator layer employing transfer matrix and asymptotic expansion techniques.…”
Section: Introductionmentioning
confidence: 99%
“…Most recently, Huang and Shen [34] investigated the dynamics of a FG plate coupled with two monolithic piezoelectric layers at its top and bottom surfaces undergoing nonlinear vibrations in thermal environments. Although the concept of developing smart structures has been extensively employed for the purpose of active vibration control of flexible structures during the past one and half decade [17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32][33][34], the main drawback of the existing monolithic piezoelectric materials which are being used in smart structures is that the control authority of these materials is very low as their piezoelectric stress/strain coefficients are of very small magnitudes. As the active damping of smart structures depends on the control authority of the piezoelectric materials, tailoring of the piezoelectric stress/strain coefficients may improve their control authority and hence the damping characteristics of lightweight smart structures can be improved.…”
Section: Introductionmentioning
confidence: 99%
“…For example, Ootao & Tanigawa [13] theoretically investigated the simply supported FG rectangular plate integrated with a piezoelectric plate subjected to transient thermal loading. A 3-D solution for rectangular FG plates coupled with a piezoelectric actuator layer was proposed by Reddy & Cheng [14] using transfer matrix and asymptotic expansion techniques.…”
Section: Introductionmentioning
confidence: 99%