“…3 it can be observed how from “High” to “Normal” there is an important change in the morphology of the microstructure, as lower current densities seem to lead towards more packed conical structures of lower overall dimensions as evidenced by the size of the crystallites. Then trend of roughness towards current density is in agreement with what is reported in the literature [ 34 , 35 ] for this range of current densities; hence the morphology should be addressed as the influencing factor of E act . Fig.…”
“…3 it can be observed how from “High” to “Normal” there is an important change in the morphology of the microstructure, as lower current densities seem to lead towards more packed conical structures of lower overall dimensions as evidenced by the size of the crystallites. Then trend of roughness towards current density is in agreement with what is reported in the literature [ 34 , 35 ] for this range of current densities; hence the morphology should be addressed as the influencing factor of E act . Fig.…”
“…As evident with film delamination in low current density prepared samples, wide distribution of larger nuclei likely results in unfavorable adhesion properties, which becomes an additional trend to mediate when designing electrodes or electrodeposition processes. 36 The findings shown here can be used to infer optimal process conditions for electrodeposition on non-planar or porous geometries. For a given geometry and desired tolerance, one can choose the appropriate Wa I (Fig.…”
The emergence of advanced manufacturing methods capable of producing porous three-dimensional structures has expanded the design space for next-generation functional components. The ability to fabricate ordered 3D foams for use in electrocatalysis reactors has increased the need for controlled deposition of catalytic metals onto porous support materials, such as carbon. However, there is a lack of clear design guidelines for electrodeposition onto 3D substrates, due to the geometric complexity and multi-scale nature of the problem. Furthermore, electro-nucleation phenomena are often overlooked in macro-scale models of current distribution during deposition. Here, a graphite flow-through electrode is used as a model system for copper deposition within a single pore. Potential distributions and electro-nucleation phenomena are coupled in a continuum level model by incorporating nucleation size and density as a function of overpotential, determined experimentally using in-situ atomic force microscopy. The model predictions are validated by measuring the coating uniformity in the pore using micro-computed X-ray tomography. A scaling analysis comprising dimensionless parameters such as the Wagner number is presented. The simplified scaling relationship framework can guide the electrodeposition process and electrode design to optimize plating of porous substrates under fluid flow conditions.
“…The nickel mold is gradually separated from the original PVC mold with the action of vertical force F . The average value of release force F was recorded by the dynamometer, and the release strength was calculated by σ = F / L [N/cm] [15,33].…”
Section: Experiments Descriptionmentioning
confidence: 99%
“…One of the key technologies for replicating the mold is to control the mold release quality [15]. Lee et al studied the process of preparing a thick, electroformed micromold by using a KMPR (commodity manufactured by Kayaku Microchem Co. Ltd., Tokyo, Japan) negative tone photoresist, and microelectroforming was performed on the KMPR mold.…”
This paper addresses the issue of mold release quality in an electrochemical replication of an optical polyvinyl chloride (PVC) mold, which has microlens array or microprisms array on its surface. The main idea is to deposit a nanoscale Cr thin layer as an antisticking layer on the PVC mold surface, followed by Ag film deposition as the conductive layer using magnetron sputtering, and finally, a nickel layer is electrochemically deposited on the Ag surface. By doing so, the upripping of the nickel mold from the PVC mold becomes easier, resulting in better mold release quality. The experiment results showed that when the Cr antisticking layer was used, the release strength between the nickel mold and the PVC substrate reduced from 1.94 N/cm to 1.43 N/cm, the surface roughness of the PVC substrate after mold release reduced from 0.60 μm to 0.55 μm, the surface roughness of the nickel mold reduced from 0.63 μm to 0.49 μm, the retroreflection coefficient of the nickel mold increased from 1600 cd·lx−1·m−2 to 2100 cd·lx−1·m−2, and the surface energy of the PVC substrate reduced from 31.47 mN/m to 15.53 mN/m.
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