From a design standpoint, the adoption of reliability-oriented approaches is crucial to improving the manufacturing yield, mainly at nanotechnologies with considerable process variability and susceptibility to radiation effects. This work shows how the use of decoupling cells with 3 fins on 7-nm FinFET layouts can mitigate the process variability up to 10.7% considering 3% and 5% of work-function fluctuations. Moreover, the process variability robustness can be 15.5% improved with the adoption of larger decoupling cells.