The IGBT is a device that combines the advantages of simplicity of drive due to the voltagecontrolled device with high impedance gate and low power dissipation due to the conductivity modulation effect. For that reason, the SiC-IGBT is used for applications that require a high breakdown voltage of S kV and more. The IGBT presented in this paper has one epilayer, a buffer layer between substrate and epilayer to improving the dynamic characteristics and a guard ring / epilayer junction to increase the saturation current. The SiC -IGBT is used in applications that require: higher current conduction capability, power losses efficiently dissipated, operation at higher temperatures, up to 6000C, and in very1 harsh environment.