Contactless Electrical Sintering of Silver Nanoparticles on Flexible Substrates

Allen, Mark; Alastalo, Ari; Suhonen, Mika; Mattila, T.; Leppäniemi, Jaakko; Seppä, Heikki

doi:10.1109/tmtt.2011.2123910

Cited by 73 publications

(43 citation statements)

References 18 publications

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“…The sintering technique provides the advantages of shorter process time and less substrate heating. Since low sintering temperature is required to make the process more practical for flexible electronics applications, similar electrical sintering technique for flexible substrate [52], [53] is currently underdeveloped for the resistivity improvement in terms of a denser microstructure with fewer defects. Fig.…”

Section: Methodsmentioning

confidence: 99%

A Combined Process of Liftoff and Printing for the Fabrication of Scalable Inkjet Printed Microstructures on a Flexible Substrate

Liang

Cheng

et al. 2015

IEEE Trans. Electron Devices

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In this paper, a combined process of liftoff and printing (CPLoP) techniques is introduced to realize size-scalable printed silver microstructures with line widths ranging from 5 to 70 μm and resistivities of ∼9.8 μ · cm on a flexible polyimide substrate via thermal sintering at 300°C for 30 min. In addition, a printed interdigitated capacitor with an electrode line width and spacing of 10 μm and a printed spiral square inductor with a 10-μm line width and 5-μm spacing in an area of 1 mm 2 have been successfully demonstrated with an area capacitance and inductance of 0.43 pF/mm 2 at 10 KHz and 1.054 μH/mm 2 up to 100 KHz, respectively, which are the orders of magnitude performance improvement in comparison with the contemporary inkjet-printed capacitors and inductors. Owing to the significant reduction of energy demand in processing tools and waste generation in processing materials, the results have revealed that the CPLoP process can facilitate the advancement of printing manufacture technology for microelectronics applications.

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Section: Methodsmentioning

confidence: 99%

A Combined Process of Liftoff and Printing for the Fabrication of Scalable Inkjet Printed Microstructures on a Flexible Substrate

Liang

Cheng

et al. 2015

IEEE Trans. Electron Devices

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“…Silver nanoparticles form an agglomeration of silver particles once they are printed, and each particle is surrounded by a polymer coating that helps nanoparticles keep in the form of ink. It has to be stressed that a sintering process through the use of laser, ultraviolet flash lamp, or microwave heating [40]- [42] is required to make the printed ink sufficiently conductive by burning off the polymer coating and the solvent impurities. Additionally, the sintering process melts the particles together and increases the bond of the silver trace with the substrate.…”

Section: Properties Of Ink-jet-printed Nanoparticlesmentioning

confidence: 99%

No Battery Required: Perpetual RFID-Enabled Wireless Sensors for Cognitive Intelligence Applications

et al. 2013

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No Battery RequiredO ver the last decade, radio frequency identification (RFID) systems have been increasingly used for identification and object tracking due to their low-power, low-cost wireless features. In addition, the explosive demand for ubiquitous rugged low-power, compact wireless sensors for Internet-of-Things, ambient intelligence, and biomonitoring/quality-of-life application has sparked a plethora of research efforts to integrate sensors with an RFID-enabled platform. The rapid evolution of large-area electronics printing technologies (e.g., ink-jet printing and gravure printing) has enhanced the development of low-cost RFID-enabled sensors as well as accelerated their large-scale deployment. This article presents a

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“…-local heating; energy is absorbed only by printed structure when it is heated by laser beam [10,11], by pulsed light [12], or by UV light [13], -delivering microwave energy [14], -electrical excitation [15], -chemical reaction in low temperature [16].…”

Section: J Felba T Fałat and A Mościckimentioning

confidence: 99%

Nano sized silver for electronic packaging

Felba

Fałat

Mościcki³

2013

2013 13th IEEE International Conference on Nanotechnology (IEEE-NANO 2013)

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Production of modern microelectronic devices needs advanced materials and packaging technologies oriented towards the miniaturization and high reliability of the systems. Nano sized silver can be treated as such advanced material and it is used in modern packaging technologies, especially for flexible electronics. The paper presents information about the practical use of silver particles with the size from 4 nanometers in materials for electronic packaging technologies.The special ink containing nanosilver is use for ink-jet printing electrically conductive structures. Such process can be applied for flexible electronics even when structures are printed on temperature sensitive materials. Ink-jet printing may be used for creating the conductive layers of microvias joining both sides of flexible substrates with acceptable level of resistance. Nano sized silver is also used as a component of hybrid filler for electrically and thermally conductive polymer based composites, although the role of nanosilver particles in transport of current or heat in such materials is limited. Nanosilver plays an increasingly important role in joints elements working at high temperatures. The sintering process is done at temperatures significantly below 300 °C and the highest shear strength of joined elements reached several dozens of MPa.J. Felba is with the Faculty

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Contactless Electrical Sintering of Silver Nanoparticles on Flexible Substrates

Cited by 73 publications

References 18 publications

A Combined Process of Liftoff and Printing for the Fabrication of Scalable Inkjet Printed Microstructures on a Flexible Substrate

A Combined Process of Liftoff and Printing for the Fabrication of Scalable Inkjet Printed Microstructures on a Flexible Substrate

No Battery Required: Perpetual RFID-Enabled Wireless Sensors for Cognitive Intelligence Applications

Nano sized silver for electronic packaging

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