2010
DOI: 10.1002/elps.201000045
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Contactless conductivity detection of small ions in a surface micro‐machined CE chip

Abstract: A microchip is presented which is capable of CE separations and is built using exclusively thin film deposition techniques, fully compatible with microelectronics batch processing. Standard photolithography provides control of the spacing between electrodes used in conductivity measurement and overall channel geometry. Fluid channels are arranged as a double-T injector with a 50 microm offset at the arm intersection. The chip's performance was tested using concentrations of sodium chloride and calcium chloride… Show more

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Cited by 11 publications
(6 citation statements)
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References 25 publications
(16 reference statements)
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“…New procedures were described in the last two years for the fabrication of PMMA , PDMS , glass , and hybrid glass/PDMS microchips employing C 4 D. For MCE‐C 4 D devices, the precise geometry of the sensing electrodes and their positioning close to the separation channel are of key importance and much more critical than for standard capillaries and several new approaches for their fabrication have been described in the last two years. Zhao et al used thermal bonding of two glass wafers for microchip fabrication.…”
Section: Electrophoresis Methods Implemented On Microfluidic Devicesmentioning
confidence: 99%
“…New procedures were described in the last two years for the fabrication of PMMA , PDMS , glass , and hybrid glass/PDMS microchips employing C 4 D. For MCE‐C 4 D devices, the precise geometry of the sensing electrodes and their positioning close to the separation channel are of key importance and much more critical than for standard capillaries and several new approaches for their fabrication have been described in the last two years. Zhao et al used thermal bonding of two glass wafers for microchip fabrication.…”
Section: Electrophoresis Methods Implemented On Microfluidic Devicesmentioning
confidence: 99%
“…A number of approaches for integrated contactless electrodes in LOC devices have been reported. These include the fabrication of micro-uidic chips on top of printed circuit boards [9][10][11][12] and glass wafers 13 containing microscale electrodes. Alternate methods have mounted the electrodes in external housings 14,15 and others have reported the deposition of metal layers onto previously etched glass wafer surfaces to form electrodes in the same plane as the analysis channels.…”
Section: Introductionmentioning
confidence: 99%
“…Shang et al reported the fabrication of a MCE-C 4 D with insulated detection electrodes. 44 Chromium electrodes were formed using an e-beam evaporator and a 100 nm SiO 2 layer provided the electrical insulation. The insulating layer was deposited by plasma-enhanced chemical vapour deposition (PECVD).…”
Section: Embedded Electrodesmentioning
confidence: 99%