Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications

Choi, Jin-Won; Oh, Tae-Sung

doi:10.2320/matertrans.m2015106

Cited by 16 publications

(14 citation statements)

References 23 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Flip Chip Technology : Flip chip bonding could be used to sit unpacked bare die onto a flexible circuit to increase flexibility and reduce volume . Choi and Oh fabricated a Si chip with the help of photoresist patterning, at the same time the Cu lead frame was transferred to a heat‐resistant fabric substrate . Then, a commercial anisotropic conductive adhesive was dispensed to the Cu/Sn bumps on the Si chip.…”

Section: Stimes Architecture and System Integrationmentioning

confidence: 99%

Smart Textile‐Integrated Microelectronic Systems for Wearable Applications

et al. 2019

View full text Add to dashboard Cite

The programmable nature of smart textiles makes them an indispensable part of an emerging new technology field. Smart textile‐integrated microelectronic systems (STIMES), which combine microelectronics and technology such as artificial intelligence and augmented or virtual reality, have been intensively explored. A vast range of research activities have been reported. Many promising applications in healthcare, the internet of things (IoT), smart city management, robotics, etc., have been demonstrated around the world. A timely overview and comprehensive review of progress of this field in the last five years are provided. Several main aspects are covered: functional materials, major fabrication processes of smart textile components, functional devices, system architectures and heterogeneous integration, wearable applications in human and nonhuman‐related areas, and the safety and security of STIMES. The major types of textile‐integrated nonconventional functional devices are discussed in detail: sensors, actuators, displays, antennas, energy harvesters and their hybrids, batteries and supercapacitors, circuit boards, and memory devices.

show abstract

Section: Stimes Architecture and System Integrationmentioning

confidence: 99%

Smart Textile‐Integrated Microelectronic Systems for Wearable Applications

et al. 2019

View full text Add to dashboard Cite

show abstract

“…Conductive adhesives are widely used in the electronic packaging applications such as die attach and solder less interconnections. For this purpose, different types of conductive adhesives for electronics packaging have been developed [99][100][101]. Snacaktar et al [102] and Mehmann et al [103] have studied epoxy-based adhesives used for joining electronics parts to fabric circuits.…”

Section: Hybrid Solder and Sewing Integrationmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-textile

Simegnaw¹,

Malengier²,

Gideon³

et al. 2021

Preprint

View full text Add to dashboard Cite

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

show abstract

“…Therefore, it is necessary to mount the components on the textile circuit, which are fabricated by other processes, to improve the performance and function of e-textiles. In previous studies, to mount the components on textile circuits, the following two types of mounting methods were used: stitching of conductive yarns on the component electrodes [9,[19][20][21] and adhesion of the components on the electrodes printed on a textile by conductive adhesives [23][24][25][26]. With respect to previous methods, small electronic components such as surface mount devices cannot be mounted.…”

Section: Introductionmentioning

confidence: 99%

Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns

2020

View full text Add to dashboard Cite

For the improvement of the performance and function of electronic textiles (e-textiles), methods for electronic component mounting of textile circuits with electrical and mechanical durability are necessary. This manuscript presents a component mounting method for durable e-textiles, with a simpler implementation and increased compatibility with conventional electronics manufacturing processes. In this process, conductive patterns are directly formed on a textile by the printing of conductive ink with deep permeation and, then, components are directly soldered on the patterns. The stiffness of patterns is enhanced by the deep permeation, and the enhancement prevents electrical and mechanical breakages due to the stress concentration between the pattern and solder. This allows components to be directly mounting on textile circuits with electrical and mechanical durability. In this study, a chip resistor was soldered on printed patterns with different permeation depths, and the durability of the samples were evaluated by measuring the variation in resistance based on cyclic tensile tests and shear tests. The experiments confirmed that the durability was improved by the deep permeation, and that the samples with solder and deep permeation exhibited superior durability as compared with the samples based on commercially available elastic conductive adhesives for component mounting. In addition, a radio circuit was fabricated on a textile to demonstrate that various types of components can be mounted based on the proposed methods.

show abstract

Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications

Cited by 16 publications

References 23 publications

Smart Textile‐Integrated Microelectronic Systems for Wearable Applications

Smart Textile‐Integrated Microelectronic Systems for Wearable Applications

Review on the Integration of Microelectronics for E-textile

Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns

Contact Info

Product

Resources

About