Contact Pressure and Load Measurement Techniques for Applications in Semiconductor Packaging

Yagnamurthy, S.; Klein, Steven A.; Haehn, Nicholas; Reynolds, S.; Harirchian, Tannaz; Chiu, Charles B.; Devasenathipathy, Shankar; Malatkar, Pramod; Liu, Haowen; Wong, Shaw Fong

doi:10.1109/ectc.2016.328

Cited by 2 publications

(2 citation statements)

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“…Thermal interface material BLT profile on the die surface depends on the load and pressure as driven by thermomechanical interaction between the package and the thermal solution. For this purpose, a thin film pressure sensor metrology [18] is used to perform in situ measurements of pressure distribution on the die. Figure 7 illustrates the sensitivity of the thermal solution attach performance, quantified as the junction-to-heat pipe thermal resistance [1][2][3][4]…”

Section: In Situ Measurement Of Thermal Solution Attachmentioning

confidence: 99%

“…This is critical for an accurate prediction of the achieved spatial pressure profile across the TIM. Model results for several spring displacement values, which are controlled by altering the height of the back plate swage nuts, are compared with the experimental data acquired using a thin-film piezo-resistive pressure sensor metrology [18], as shown in Fig. 10.…”

Section: Structural Modelingmentioning

confidence: 99%

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Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Uppal

Peterson

Chang

et al. 2019

Journal of Electronic Packaging

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The demands for both thinner bare-die ball grid array (BGA) packages and thinner thermal solutions have added complexity for the thermal enabling design and material options associated with system on chip packages in mobile personal computer (PC) platforms. The thermomechanical interactions between the bare-die package and the thermal solution are very critical, creating the needs for: (1) an in-depth thermomechanical characterization to understand their impacts on product quality and performance and (2) a simple and yet robust modeling methodology to analyze design parameters using a commercially available software. In this paper, experimental metrologies and modeling methodology are developed with the details of contents documented. Validation of the newly developed tools and recommendation/guidance are also discussed for detailed assessments of thermomechanical tradeoffs for optimal design spaces for next-generation mobile platforms.

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