Constructal studies on hexagonal microchannel heat sinks based on multi-physics field coupling calculations

Progress in theoretical study on constructal optimization of marine steam power plants

“…针对现有传热学理论中存在的不足, 过增元院士 等人 [22] 基于热量传递现象的本质定义了描述物体所 具有的热量传递总能力的新物理量-- 、 对流传热 [23~25,27,28,57,66~73] 、换热器 [23~25, 27,29] 、传 质 [23,27] 、化学反应系统 [26] 、热力循环系统 [25,62~64,74,75] 等各种传热和热力过程和系统进行了分析和优化, 其 中正六边形热沉 [68] 、潜热储热器 [69] 、纳米流体 [70] 、 黏性热的作用 [72]…”

Suitability of Embedded Liquid Cooling and Heat Generation for Chips

“…The liquid cooling heat sink has become a widely favored chip-heat dissipation solution owing to its small size [5], strong heat dissipation capacity, and easy packaging. To further improve the heat dissipation capacity of the liquid cooling heat sink, several scholars have conducted research on the optimal design of the liquid cooling heat sink [6][7][8][9][10][11][12][13][14][15]. Among them, the embedded heat sink cooling technology shortens the heat dissipation path of the chip from "chip-TIM-packing-shell-TIM-heat sink" to "chip-heat sink-working fluid", that is, it bypasses the chip packaging and directly cools the hotspot of the chip [16], effectively coping with the more severe heat dissipation challenge caused by the surge during chip integration.…”