Constrained Sintering of Low‐Temperature Co‐Fired Ceramics

Abstract

This paper discusses the effect of uniaxial compressive stress and pressureless constraint on the microstructure, density, and shrinkage anisotropy during the sintering of two commercial low-temperature co-fired ceramic (LTCC) systems, i.e., Heraeus CT2000 (CT) and DuPont 951Tape (DU). Under uniaxial compression, the ratio of axial to transverse shrinkage of DU is significantly higher than that of CT. A simple linear viscous theory was used to estimate the change in the strain rates produced by the external stress and the stress required to produce zero shrinkage. The theory was found to overestimate the measured stress-induced strain rates. The uniaxial compressive stress required for zero overall shrinkage was estimated to be B60 kPa for DU and 80 kPa for CT. The estimate for the DU materials was in good agreement with the experimental data, but there was significant deviation for the CT material. Higher viscosity and higher constraining stresses led to lower densities in pressure-less constrained CT specimens compared with DU. 1923J ournal

Microstructure and mechanical properties of an alumina–glass low temperature co-fired ceramic

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Shrinkage behavior of LTCC hetero-laminates

“…Physical constraining that comes from different densification routes may be one of the most important parameters when the reliability and reproducibility are critical. [12][13][14][15] Most of these reported studies on the so-called "constraining sintering" are based on LTCC materials designed to generate zero-shrinkage after firing. * Corresponding author.…”

Blister defect formation within partially stabilized zirconia film during constrained sintering

“…Anisotropic shrinkage in constrained sintering film has been observed in many studies [10][11][12][13][14][15][16][17][18]. Although this phenomenon is obvious in the presence of inclusions and inhomogeneous green density distribution within the pre-sintered film, it also arises when the film is uniformly deposited onto the substrate.…”

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