2015
DOI: 10.1007/s40145-015-0136-2
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Blister defect formation within partially stabilized zirconia film during constrained sintering

Abstract: Yttria stabilized zirconia (YSZ) film has been screen printed and sintered on a rigid substrate. The constrained sintering caused the formation of multiple microcracks and most critically large "blister" defects. The morphology of such defects has been characterized by scanning electron microscopy (SEM). It was revealed that the film surface exhibits noticeable roughness. Microhardness testing revealed little variation in green density distribution. Rheological measurement, however, showed that some agglomerat… Show more

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Cited by 4 publications
(3 citation statements)
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“…3 Yttria-stabilized zirconia (YSZ) is one of the most commonly used electrolyte materials for SOFC due to its good chemical stability, excellent mechanical properties, and high oxygen ionic conductivity. [4][5][6] However, the sintering temperature of YSZ is usually higher than 1500 • C, which increases the production cost. 5,7 Besides the high cost, the high sintering temperature is sometimes problematic.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…3 Yttria-stabilized zirconia (YSZ) is one of the most commonly used electrolyte materials for SOFC due to its good chemical stability, excellent mechanical properties, and high oxygen ionic conductivity. [4][5][6] However, the sintering temperature of YSZ is usually higher than 1500 • C, which increases the production cost. 5,7 Besides the high cost, the high sintering temperature is sometimes problematic.…”
Section: Introductionmentioning
confidence: 99%
“…Solid oxide fuel cell (SOFC) has advantages of high energy conversion efficiency and no emission of environmental pollutants 3 . Yttria‐stabilized zirconia (YSZ) is one of the most commonly used electrolyte materials for SOFC due to its good chemical stability, excellent mechanical properties, and high oxygen ionic conductivity 4–6 …”
Section: Introductionmentioning
confidence: 99%
“…Residual stresses are developed during the manufacturing process of the cells due to the thermo-elastic mismatch between the cell layers [5][6][7][8][9][10][11]. These residual stresses can result in performance degradation as a result of delamination [11] or the formation of cracks in the cell layers [3,11] and in the extreme case may lead to the complete deterioration of the cell [12][13][14].…”
Section: Introductionmentioning
confidence: 99%