Constituents and performance of no-clean flux for electronic solder

Wakeel, Saif; Haseeb, A.S.M.A.; Afifi, M.; Bingöl, Sedat; Hoon, Khoo Ly

doi:10.1016/j.microrel.2021.114177

Cited by 22 publications

(5 citation statements)

References 30 publications

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“…Optical epoxies and InterVia are made of solvent, epoxy resin, coupling agent, and adhesives 47 – 50 Based on the datasheet provided by suppliers, bisphenol A-(epichlorohydrin) epoxy resin (number average molecular weight≤700) was used in InterVia 48 . Whereas OP-29 Dymax was prepared with 2-hydroxyethyl methacrylate (molecular weight=130 g/mol) epoxy resin 49 .…”

Section: Resultsmentioning

confidence: 99%

“…In the μTP process, a PDMS stamp is put in contact with the lens surface and process parameters, such as shear distance, speed, and retraction, may change the microstructure and roughness of lenses. This change in roughness will affect the coupling of light in and out of the PIC 50 . The highly rough surface of optical devices reduces light coupling due to scattering 51 …”

Section: Resultsmentioning

confidence: 99%

“…This change in roughness will affect the coupling of light in and out of the PIC. 50 The highly rough surface of optical devices reduces light coupling due to scattering. [51][52][53] This has been proven in a study where the effect of surface roughness of fiber surface on light coupling efficiency was demonstrated.…”

Section: Discussionmentioning

confidence: 99%

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Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Wakeel,

Morrisey,

Genc

et al. 2023

J. Optical Microsystems

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Micro-transfer printing (μTP) has been widely used to integrate photonic components, such as lasers, modulators, photodetectors, micro-LEDs, on Si photonic platforms. There is a push toward the μTP of optical components in photonics packaging as it enables wafer-scale integration with high alignment accuracy. We demonstrate for the first time the μTP of thick optical components, such as micro-lenses, in the range of 250 to 1000 μm thickness. We explore the reliability of bonding such components using an ultraviolet (UV) curable epoxy and compare them with the current state of the art. The results show that the average shear strength of lenses bonded with InterVia is 19 MPa which is higher than currently used optical epoxies. Also, μTP process has no effect on the surface roughness and microstructure of lenses. Using our approach, we demonstrate how thick silicon and fused silica lenses can be integrated into photonic integrated circuits (PICs) using a tether-free process that is highly scalable and robust.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

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Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Wakeel,

Morrisey,

Genc

et al. 2023

J. Optical Microsystems

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“…However, recent development shows that the usage of no-clean flux still has flux residue (Gacs et al , 2020; Conseil-Gudla et al , 2021; Li et al , 2021). Reflow soldering leaves a minimal residue due to localized residue formation as compared with the wave soldering process (Wakeel et al , 2021). Veselý et al (2020) have highlighted the flux residue from solder paste during the reflow soldering and its effects on the solder joint quality.…”

Section: Resultsmentioning

confidence: 99%

Effect of alloy particle size and stencil aperture shape on solder printing quality

Sunar¹,

Bakar

Jalar

et al. 2022

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Purpose Reflow solder joint quality is significantly affected by the ability of the solder to perfectly fill pad space and retain good solder joint shape. This study aims to investigate solder joint quality by quantitatively analyzing the stencil printing-deposited solder volume, solder height and solder coverage area. Design/methodology/approach The dispensability of different solder paste types on printed circuit board (PCB) pads using different stencil aperture shapes was evaluated. Lead-free Type 4 (20–38 µm particle size) and Type 5 (15–25 µm particle size) solder pastes were used to create solder joints according to standard reflow soldering. Findings The results show that the stencil aperture shape greatly affects the solder joint quality as compared with the type of solder paste. These investigations allow the development of new strategies for solving solder paste stencil printing issues and evaluating the quality of solder joints. Originality/value The reflow soldering process requires the appropriate selection of the stencil aperture shape according to the PCB and the solder paste according to the particle-size distribution of the solder alloy powder. However, there are scarce studies on the effects of stencil aperture shape and the solder alloy particle size on the solder paste space-filling ability.

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“…This can increase the risk of short circuits or the susceptibility to dendritic growth (electrochemical migration), specifically in high electric fields and humid environments [ 28 , 29 ]. Additionally, in humid environments, flux residues can form an electrically conductive layer, increasing the leakage current [ 30 ], further contributing to the risk of short circuits.…”

Section: Discussionmentioning

confidence: 99%

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation

Sorokina,

Dušek,

Bušek

2024

Materials

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This study presents a new approach to investigating the impact of repeated reflow on the failure of ball grid array (BGA) packages. The issue with the BGA package collapse is that the repeated reflow can lead to short circuits, particularly for BGAs with a very fine pitch between leads. A novel approach was developed to measure the collapse of BGA solder balls during the melting and solidification process, enabling in situ measurements. The study focused on two types of solders: Sn63Pb37 as a reference, and the commonly used SAC305, with measurements taken at various temperatures. The BGA samples were subjected to three different heating/cooling cycles in a thermomechanical analyzer (TMA) at temperatures of 250 °C, 280 °C, and 300 °C, with a subsequent cooling down to 100 °C. The results obtained from the TMA indicated differences in the collapse behavior of both BGA solder alloys at various temperatures. Short circuits between neighboring leads (later confirmed by an X-ray analysis) were also recognizable on the TMA. The novel approach was successfully developed and applied, yielding clear insights into the behavior of solder balls during repeated reflow.

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Constituents and performance of no-clean flux for electronic solder

Cited by 22 publications

References 30 publications

Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Effect of alloy particle size and stencil aperture shape on solder printing quality

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation

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