Configurable Low-Latency Interconnect for Multi-core Clusters

Abstract

Abstract. Shared L1 memories are of interest for tightly-coupled processor clusters in programmable accelerators as they provide a convenient shared memory abstraction while avoiding cache coherence overheads. The performance of a shared-L1 memory critically depends on the architecture of the low-latency interconnect between processors and memory banks, which needs to provide ultra-fast access to the largest possible L1 working set. The advent of 3D technology provides new opportunities to improve the interconnect delay and the form factor. In this chapter we propose a network architecture, 3D-LIN, based on 3D integration technology. The network can be configured based on user specifications and technology constraints to provide fast access to L1 memories on multiple stacked dies. The extracted results from the physical synthesis of 3D-LIN permit to explore trade-offs between memory size and network latency from a planar design to multiple memory layers stacked on top of logic, evaluating the improvement in both form factor and latency.

Online process transformation for polyhedral process networks in shared-memory MPSoCs

“…All MicroBlaze cores share a tightly-coupled scratchpad memory (SPM) through a high-bandwidth, lowlatency logarithmic interconnect [13]. The shared SPM is organized in banks that can be independently accessed in a bank-or word-interleaved fashion to minimize contention.…”