Conductivity mechanisms of isotropic conductive adhesives (ICAs)

Lu, Daoqiang; Tong, Q.K.; Wong, Ching‐Ping

doi:10.1109/6104.795857

Cited by 79 publications

(21 citation statements)

References 8 publications

(12 reference statements)

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“…In the case of TCA, fillers can contact tightly with each other by the compression and shrinkage of the epoxy during the curing process (Su and Qu 2004;Falat et al 2007;Lu et al 1999). This idea can be reflected by the developed model.…”

Section: Resultsmentioning

confidence: 99%

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

Zhang

et al. 2010

Microsyst Technol

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In the present paper, a novel and efficient model was developed for predicting the effective thermal conductivity of the composite materials at different filler percentages. By introducing the relative radius as a parameter, the effective thermal conductivity can be predicted precisely when the thermal properties of filler and matrix are prescribed. The model employed the resistor network strategy to achieve a highly efficient prediction during the overall conductivity calculation. To verify this model, a wide range of two-phase composites, including Cu/PP, AlN/PI and a self-developed thermal conductive adhesive, were analyzed. The model-based simulation values showed good agreement with the experimental results. Moreover, a discussion on the effects of the newlyintroduced parameter was given. Finally, the relationship between the filler radius variation and the thermal conductivity of the composite was studied.

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Section: Resultsmentioning

confidence: 99%

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

Zhang

et al. 2010

Microsyst Technol

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“…As reflected in a considerable number of articles,6, 7, 15–65 in the last 2 decades, epoxy‐based ECAs have been developed for interconnections in electronic applications as an environmentally friendly alternative to traditional tin/lead solders. Another advantage is that epoxy‐based solders can be used at higher temperatures.…”

Section: Epoxy‐based Ecasmentioning

confidence: 99%

Electrically conductive adhesives with a focus on adhesives that contain carbon nanotubes

Santamaría

Muñoz

Fernández

et al. 2013

J of Applied Polymer Sci

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On the basis of an analysis of results presented in the literature, the currently existing knowledge about relationships between the microstructural and physical properties of hard coatings is discussed. Particular emphasis is placed on the role of microstructural features, such as grain boundaries, nonequilibrium structures, impurities, and texture, in controlling the film hardness. On the basis of an analysis of results presented in the literature, the currently existing knowledge of electrically conductive adhesives (ECAs) is discussed. Particular focus is placed on the results obtained with ECAs that contain carbon nanotubes (CNTs) as conductive fillers. The review is divided in curable ECAs based on epoxy resins, and noncurable conductive hot melts and pressure-sensitive adhesives based on thermoplastic polymers. More literature results were found for epoxy/conductive filler ECAs than for other adhesives. Confirming the assessments made in a book by Li et al., which refers to nanotechnologies in ECAs, we found that only a reduced number of articles allude to polymer/CNT ECAs. Our analysis of the results includes a study of the balance between the viscosity, immediate adhesion, solidification process, electrical conductivity, and mechanical properties of the adhesives.

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“…Thus, the Ag-based conductive adhesive has attracted considerable attention of researchers in the last decade. 12,13 The conduction mechanism in the Ag-based conductive adhesive has not yet been fully understood, despite extensive studies being carried out in the past. One of the unsolved problems is the irreversible change in the current versus voltage ͑I-V͒ characteristics of the cured sample.…”

Section: Introductionmentioning

confidence: 99%

Local conductivity and electric field analysis of Ag-based conductive adhesive by transmission electron microscopy

Kawamoto

Murakami

Shindo

2010

Journal of Applied Physics

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The conduction mechanism in Ag-based conductive adhesive, which has attracted the attention of researchers, has been intensively studied by the in situ observations of transmission electron microscopy (TEM) and by using special methods that employ the use of microprobes; Ag-based conductive adhesive is considered as an alternative to Pb-free solders. A current versus voltage (I-V) curve measured by using a microscope exhibited peculiar fluctuations, which implied an irreversible change in the internal structure of a cured adhesive. TEM observations showed a local shape change in Ag agglomerations, such as the formation of small horns, in a sample that was subjected to a large electric current of 1 μA. Electron holography data, which revealed the inhomogeneous distribution of equipotential lines in the sample, also implied an essential role of morphological change in the conduction properties of Ag-based conductive adhesive.

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Conductivity mechanisms of isotropic conductive adhesives (ICAs)

Cited by 79 publications

References 8 publications

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

Electrically conductive adhesives with a focus on adhesives that contain carbon nanotubes

Local conductivity and electric field analysis of Ag-based conductive adhesive by transmission electron microscopy

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