The purpose of this study is to develop epoxy composites with improved mechanical, thermal, and electrical properties. Semiconducting glass (SG) binary systems such as As 2 S 3 -TlS and As 2 Se 3 -TlS were synthesized in various mole ratios (1:1 and 1:3). Electrically conductive DGEBA-type epoxy-SG-filled composites were developed containing 1-15 wt% of fillers and characterized by X-ray diffraction and scanning electron microscopy techniques. As a result, the effects of the type and amount of semiconductive filler on the mechanical, thermal, and electrical properties of commercial epoxy resins (ERs) were examined. It was found that I 2 doping of the filler significantly increased the electrical conductivity of the composites up to 10 23 S cm 21 . Percolation concentrations were found to be 7 wt% for all composites studied. The maximum tensile strength changed in the range of 86-114 MPa was obtained with 5-10 wt% of SG particles. In addition, the thermal behavior and stability of the epoxy composites were studied using thermogravimetric analysis. The incorporation of SG particles increased the 10% decomposition temperature of neat epoxy by 58C-358C. ER/SG coatings showed the best adhesion results and perfect resistance to 3% NaCl, 3% HCl, and 5% NaOH solutions. POLYM. COMPOS., 39:681-690, 2018.