Concurrent Optimization of Crescent Bond Pull Force and Tail Breaking Force in a Thermosonic Cu Wire Bonding Process

Lee, J.; Mayer, Michael; Zhou, Y.; Hong, S. J.; Moon, J.T.

doi:10.1109/tepm.2009.2019338

Cited by 15 publications

(1 citation statement)

References 7 publications

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“…Good and poor bond observation in lead frame PKG 2 nd workability can be affected by the degree of TBF. [8,9] In Table 2, the TBF values of Copper wire are lower and its deviations are higher compared to Gold. Therefore, the frequency of short tail problems can occur more often in Copper wire and it seems that this is dependent on the kind of dopant and its amount.…”

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confidence: 99%

Achieving high workability in high-end package by controlling microstructure of 4N Cu wire

Kim¹,

Park²,

Kim³

et al. 2009

2009 11th Electronics Packaging Technology Conference

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confidence: 99%

Achieving high workability in high-end package by controlling microstructure of 4N Cu wire

Kim¹,

Park²,

Kim³

et al. 2009

2009 11th Electronics Packaging Technology Conference

Self Cite

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Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Gong

2022

Adv Materials Technologies

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Micro light‐emitting diode (Micro‐LED) display is an emerging display technology thanks to its high brightness, fast switching speed, and low power consumption. The commercialization of this technique is being explored by developing advanced processing techniques on an industrial scale. Recent ground‐breaking advances in the manufacture of Micro‐LEDs are mainly based on powerful laser micro/nano‐processing techniques with the unique ability to fabricate materials, structures and devices with the advantages of non‐contacting processing, high efficiency, adjustable coverage from micro‐ to macroscale and the compatibility with organic and inorganic materials. This paper categorizes, reviews and analyzes the main challenges and technical solutions in the Micro‐LED displays by various laser manufacturing processes, covering chip dicing, geometry shaping, laser annealing, laser lift‐off (LLO), laser‐based Micro‐LED transfer, laser‐assist bonding (LAB) and laser repair. The fundamental principles of these techniques are discussed along with their basic mechanisms, followed by an exploration of the latest progress in the field. Finally, a detailed analysis of the advantages and disadvantages of these techniques is given, and the future research directions of laser techniques in Micro‐LED display are discussed.

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Bonding Process

Chauhan

Choubey²,

Zhong

et al. 2013

Copper Wire Bonding

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Concurrent Optimization of Crescent Bond Pull Force and Tail Breaking Force in a Thermosonic Cu Wire Bonding Process

Cited by 15 publications

References 7 publications

Achieving high workability in high-end package by controlling microstructure of 4N Cu wire

Achieving high workability in high-end package by controlling microstructure of 4N Cu wire

Laser‐Based Micro/Nano‐Processing Techniques for Microscale LEDs and Full‐Color Displays

Bonding Process

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