Concept for performance-enhancement of ultra-precision dicing for bulk hard and brittle materials in micro applications by laser dressing

Stompe, Manuel; Witzendorff, Philipp von; Cvetković, Srecko; Moalem, Anas; Stute, U.; Rissing, Lutz

doi:10.1016/j.mee.2012.07.033

Cited by 8 publications

(3 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These applications usually demand to cut off the materials or fabricate micro structure on the surface. Besides electrochemical machining [3], laser beam machining [4], water jet cutting [5], abrasive jet cutting and mechanical cutting [6], Grinding with dicing blade is an very important method to cut and fabricate miro figures on surface of these material [7]. It removes material by scratching workpiece with diamond grits in dicing blades [8].…”

Section: Introductionmentioning

confidence: 99%

Preparation and characterization of ultra-thin dicing blades with different bonding properties

Yuan

Feng

2022

Int J Adv Manuf Technol

View full text Add to dashboard Cite

Ultra-thin dicing blade is usually used to achieve a high precision cutting in semiconductor back-end packaging and assembly. Lots of interactional parameters involving in dicing blade preparation and cutting process bring difficulties to high cutting qualities and good working life of dicing blade. In order to address these problems, this study prepared three kinds of dicing blades and characterized the cutting properties of three dicing blades. It first proposed the abrasive exposure coefficient and tool deviation coefficient to provide parameters for the cutting force model. Then the experimental apparatus was set up to verify the proposed cutting force model. And a series of parameters including feed rate, spindle current, edge chipping coefficient, tool wear amount and grinding performance are used to characterize the comprehensive performance of prepared dicing blades. Finally, the edge morphology was observed under 3D microscope to analysis the hardness of different dicing blades. The theoretical and experimental results indicate that the proposed cutting force model can reflect actual cutting process. There is an inverse proportional function between the shedding of abrasive particles and the hardness of the matrix. The cutting performance of dicing blades is very dependent on the material of workpiece. C-dicing blades presents outstanding comprehensive effects with small chips and good self-sharpening properties.

show abstract

Section: Introductionmentioning

confidence: 99%

Preparation and characterization of ultra-thin dicing blades with different bonding properties

Yuan

Feng

2022

Int J Adv Manuf Technol

View full text Add to dashboard Cite

show abstract

“…1,11,16 Furthermore, TiC whisker enhancement, abrasive grain sizes and laser dressing are investigated to improve the cutting performance of dicing blade. 17–19 Basically, the quality of kerf depends on the combination of the material on work and parameters of the cutting process, cooling system, feed speed, type of blade and peripheral speed. For the ultraprecision dicing of hard and brittle materials, chip fracture is an important failure mechanism.…”

Section: Introductionmentioning

confidence: 99%

“…21,22 In order to avoid chip fracture, it is essentially important to investigate and determine the optimal machining conditions and the novel dicing blade preparation. 19 The comprehensive factors that affect chipping size, however, are not well understood.…”

Section: Introductionmentioning

confidence: 99%

Investigation on the fabrication of dicing blades with different sintering methods for machining hard-brittle material wafers

Yuan

Cheng

Zhang

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part B:

View full text Add to dashboard Cite

Hard-brittle materials applied in various micro-electromechanical systems should be sliced into miniature and microparts often with complex microstructures. However, it is difficult for bladed dicing to machine those materials without damage because of their hard and brittle properties. This article presents innovative design and fabrication of dicing blades and the associated dicing process optimization, particularly by focusing on the blade wheel fabrication through sintering methods including traditional hot press sintering, vacuum sintering and spark plasma sintering. Four key parameters, namely, the radial wear of the dicing blade, the current of relay, the number of chips larger than 50 μm and the largest chip size, are employed to assess the cutting performance of dicing blades fabricated. The analysis and experimental results indicate that the spark plasma sintering method achieves the lowest number of chips and the smallest chip size due to its rapid spark between metal particles during the sintering process. The spark plasma sintering method can also produce a granular microstructure with sufficient porosities, which results in uniform bonding strength of diamond abrasive grits within the dicing blade. For the dicing process parameters, the back cutting depth has the most obvious influence on the dicing blade tool life, cutting current and slicing damages, while the feed rate is ranked the next. The least influencing parameter is the dicing spindle rotational speed.

show abstract

Experimental investigation on ultrasonic-assisted truing/dressing of diamond grinding wheel with cup-shaped GC wheel

Qiao

Sun

et al. 2022

Int J Adv Manuf Technol

View full text Add to dashboard Cite

Concept for performance-enhancement of ultra-precision dicing for bulk hard and brittle materials in micro applications by laser dressing

Cited by 8 publications

References 7 publications

Preparation and characterization of ultra-thin dicing blades with different bonding properties

Preparation and characterization of ultra-thin dicing blades with different bonding properties

Investigation on the fabrication of dicing blades with different sintering methods for machining hard-brittle material wafers

Experimental investigation on ultrasonic-assisted truing/dressing of diamond grinding wheel with cup-shaped GC wheel

Contact Info

Product

Resources

About