2005
DOI: 10.1149/1.1858791
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Concentration Effect of HF on Energy Band Diagram for n-Si(100)/HF Photoelectrochemical Etching System

Abstract: The aim of this work was to build a thermodynamic energy band diagram for the system of n-type Si͑100͒/HF that is in dynamic equilibrium at the interface. The construction concept was based on the shift of energy levels such as Fermi energy (E F ), conduction band energy (E c ), and valence band energy (E v ) before and after the contact of silicon with HF solutions. Through measurements of the open-circuit potential and flatband voltage (V FB ), the energy band diagram for the Si/HF system was established. Th… Show more

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Cited by 5 publications
(5 citation statements)
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“…In BHF solution, we expect the n -type regions of the i–n–i segments to selectively etch, and all of these regions exhibited good etching independent of the SiH 4 partial pressure. The only minor effect was a slight increase in the etch rate with increasing surface Au, which could be attributed to the appearance of a metal-assisted etch mechanism. , However, the relatively minor effect suggests that etching of n -type Si in BHF occurs primarily by the dopant-dependent electrochemical etch mechanism. , Note that in a control study shown in Figure S4, we found that the total reactor pressure in the CVD system played no role in the deposition of Au on the NW surfaces and that instead the SiH 4 partial pressure was the key deterministic factor.…”
Section: Resultsmentioning
confidence: 73%
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“…In BHF solution, we expect the n -type regions of the i–n–i segments to selectively etch, and all of these regions exhibited good etching independent of the SiH 4 partial pressure. The only minor effect was a slight increase in the etch rate with increasing surface Au, which could be attributed to the appearance of a metal-assisted etch mechanism. , However, the relatively minor effect suggests that etching of n -type Si in BHF occurs primarily by the dopant-dependent electrochemical etch mechanism. , Note that in a control study shown in Figure S4, we found that the total reactor pressure in the CVD system played no role in the deposition of Au on the NW surfaces and that instead the SiH 4 partial pressure was the key deterministic factor.…”
Section: Resultsmentioning
confidence: 73%
“…40,41 However, the relatively minor effect suggests that etching of n-type Si in BHF occurs primarily by the dopant-dependent electrochemical etch mechanism. 42,43 Note that in a control study shown in Figure S4, we found that the total reactor pressure in the CVD system played no role in the deposition of Au on the NW surfaces and that instead the SiH 4 partial pressure was the key deterministic factor. The reproducibility of the Au etch stop behavior in KOH solution was confirmed through the growth of intrinsic NWs with the SiH 4 partial pressure periodically modulated between 20 and 200 mTorr, as shown in Figure 4A.…”
Section: Resultsmentioning
confidence: 77%
“…The space-charge region exists between the electrolyte and silicon due to their different Fermi levels, resulting in the bending of the energy band. 35 Charge transfer also occurs at the interface between the silicon and HF solution. Both types of charge carriers ͓i.e., electrons and holes ͑h + ͔͒ may participate in the charge-transfer process.…”
Section: Discussionmentioning
confidence: 99%
“…A concerted reaction mechanism would avoid the production of the highly strained intermediate. Other reactions are possible as well, including an acid-catalyzed oxidation reaction , or a photo- or electrochemical reaction. ,, …”
Section: Discussionmentioning
confidence: 99%
“…Other reactions are possible as well, including an acid-catalyzed oxidation reaction 43,44 or a photoor electrochemical reaction. 9,14,45 4.2. Key Spectral Indicators of Si(100) Faceting and Hillock Formation.…”
Section: Discussionmentioning
confidence: 99%